Three-dimensional NoC noise model and simulating method thereof

A simulation system and noise technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of not considering the power distribution network of the system, and the influence of noise cannot be simulated, so as to solve the problem that the influence of noise cannot be simulated and improve Effects of Simulation Accuracy

Inactive Publication Date: 2010-06-02
成都成电电子信息技术工程有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This model does not consider the influence of the system power distribution network, and the influence of non-Gaussian distributed noise in the NoC cannot be simulated

Method used

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  • Three-dimensional NoC noise model and simulating method thereof
  • Three-dimensional NoC noise model and simulating method thereof
  • Three-dimensional NoC noise model and simulating method thereof

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Experimental program
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Effect test

Embodiment 1

[0054] In Embodiment 1, the metal lines of the upper, middle and lower layers are parallel lines.

[0055] Such as figure 1 , figure 2 , image 3 , Figure 4 with Image 6 As shown, INV_* (where * is a number) in the model is an inverter model, which has 4 pins: power supply V DD , ground GND, input pins and output pins. In the model, an inverter is used to drive a wire, followed by an inverter to simulate the driving relationship. exist Image 6 The disturbed line is the signal line driven by INV_23, and the disturbed line is the signal line driven by INV_11, INV_13, INV_15, INV_21, INV_25, INV_31, INV_33, and INV_35. Two equivalent capacitances across the junction between two π models are used in the model to simulate crosstalk effects.

[0056] Since the power distribution network of the system is located at the outermost layer and its main function is to provide power for the system, the equivalent model of the power supply package should also be located at the ou...

Embodiment 2

[0068] Embodiment 2 is described by taking an example in which the upper and lower layers of wires are perpendicular to the middle layer of wires.

[0069] Such as figure 1 , figure 2 , image 3 , Figure 5 with Figure 7 As shown, INV_* (where * is a number) in the model is an inverter model, which has 4 pins: power supply V DD , ground GND, input pins and output pins. In the model, an inverter is used to drive a wire, followed by an inverter to simulate the driving relationship. The upper wire is modeled with a 2-segment π model, and the middle wire is modeled with a 1-segment π model. The underlying wires are modeled with a 2-segment π model. exist Figure 7 The disturbed line is the signal line driven by INV_23, and the disturbed line is the signal line driven by INV_11, INV_13, INV_21, INV_25, INV_31, and INV_33. Two equivalent capacitances across the junction between two π models are used in the model to simulate crosstalk effects.

[0070] Since the power dist...

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Abstract

The invention discloses a tridimensional NoC noise model, which consists of a system power supply encapsulation equivalent model, a power supply distribution network equivalent model, a signal line pi-mode equivalent model and a tridimensional crosstalk model. The invention further discloses a simulation method for the tridimensional NoC noise model based on the tridimensional NoC noise model. Thesimulation method comprises the following steps: (1) the parasitic parameters and the driving power parameters of the system power supply encapsulation equivalent model, the power supply distributionnetwork equivalent model, the signal line pi-mode equivalent model and the tridimensional crosstalk model are acquired; (2) an artificial circuit is established according to the tridimensional NoC noise model; (3) the constraint conditions of the exotic environment are set; (4) a simulation tool is operated for simulation; (5) the sampling result at an hour is acquired according to the simulation, thus acquiring the equivalent distribution of all noise. By adopting the tridimensional NoC noise model, not only a noise source subject to Gaussian distribution is simulated; but also a noise source not subject to Gaussian distribution is simulated. The tridimensional NoC noise model is mainly applied on network on chip.

Description

technical field [0001] The invention relates to a noise model and a simulation method thereof, in particular to a three-dimensional NoC noise simulation system and a simulation method thereof. Background technique [0002] The research on the network on chip started in 1999, the original intention of the research was to explore the system-level design method of the communication part of the system on chip. Soon, research involved everything from physical design to architecture, operating systems, and applications. At present, the concept of a network on a chip is very broad, including hardware communication structure, middleware, operating system communication services, and design methods and tools. From the perspective of system structure, the research focus of the network on chip is the topology structure of the network on chip, the protocol of the network on chip, the quality of service of the network on chip and the low power consumption of the network on chip. [0003...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 李磊胡剑浩何春周婉婷
Owner 成都成电电子信息技术工程有限公司
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