Light-emitting device, method for manufacturing light-emitting device, and substrate processing apparatus
A substrate processing device and light-emitting element technology, which is applied in the field of substrate processing devices and light-emitting elements, can solve problems such as difficulty in using sputtering, and achieve the effect of reducing thickness deviation
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Embodiment 1
[0065] figure 1 It is a cross-sectional view schematically showing the light-emitting element of Example 1 of the present invention. refer to figure 1 The light-emitting element 100 of this embodiment has an anode electrode 102 formed on a substrate 101, a cathode electrode 104 opposite to the anode electrode 102, and a light-emitting layer (organic EL) formed between the anode electrode 102 and the cathode electrode 104. layer) the organic layer 103 of 103A.
[0066] The light-emitting element 100 is also called an organic EL element, and adopts a structure in which holes are injected from the anode electrode 102 and holes are injected from the The cathode electrode 104 injects electrons and recombines them, thereby causing the light emitting layer 103A to emit light.
[0067] The light emitting layer 103A can be formed using materials such as polycyclic aromatic hydrocarbons, heteroaromatic compounds, organic metal complexes, etc., and the above materials can be formed by...
Embodiment 2
[0100] Next, according to Figure 3 ~ Figure 5 An example of the configuration of a substrate processing apparatus for manufacturing the light-emitting element 100 described in Example 1 will be described.
[0101] first, image 3 It is a plan view schematically showing an example of the structure of the substrate processing apparatus 1000 for manufacturing the light-emitting element 100 described above.
[0102] refer to image 3 The substrate processing apparatus 1000 of this embodiment has a structure in which a plurality of film forming apparatuses or processing chambers are connected to any one of the transfer chambers 900A, 900B, and 900C for transferring substrates to be processed. Each of the transfer chambers 900A, 900B, and 900C has four connection surfaces for connecting to a processing chamber or a film forming apparatus. In addition, the transfer chambers 900A, 900B, and 900C have a structure in which transfer units (transfer arms) 900a, 900b, and 900c for tran...
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Abstract
Description
Claims
Application Information
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