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Mounting method, board with electrical component, and electrical apparatus

A technology of electrical components and installation methods, which is applied in the direction of electrical components, electrical solid devices, and printed circuits assembled with electrical components, can solve problems such as positional deviation of electrical components, and achieve the effect of high reliability

Inactive Publication Date: 2009-03-25
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with this method, there is a positional shift of about 25 μm in electrical components

Method used

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  • Mounting method, board with electrical component, and electrical apparatus
  • Mounting method, board with electrical component, and electrical apparatus
  • Mounting method, board with electrical component, and electrical apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0086] 5 g of trimethylolpropane triacrylate as a radiation curable resin, 0.1 g of a product named "IRGACURE 184" manufactured by Ciba Geigy Co., Ltd. as a photopolymerization initiator, and 20 g of epoxy resin (trade name "EPIKOTE 828" manufactured by Japan Epoxy Resin Co., Ltd.) as thermosetting resin, phenoxy resin (trade name manufactured by Tohto Chemical Co., Ltd.) as thermoplastic resin 10 g of "YP50"), 40 g of a hardener for thermosetting resin (trade name "HX3941HP" manufactured by Asahi Kasei Chemicals Co., Ltd.), 10 g of nickel particles (diameter 5 μm, spherical) as conductive particles, manufactured Become the adhesive in the embodiment. The adhesive is brown to taupe, and is a paste at room temperature.

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Abstract

The present invention relates to a mounting method, a board with electrical component, and an electrical apparatus. An adhesive layer (20) contains a thermosetting resin and a radiation-curable resin. A part of the adhesive layer (20) overlaps from the edges of an electrical component (15). Radiation (29) is not transmitted through the electrical component (15). Therefore, the radiation-curable resin is not polymerized at the portion of the adhesive layer (20) positioned just at the rear of the electrical component (15) but polymerized at the projecting portions (26). Since the electrical component (15) is fixed by the polymerized radiation-curable resin, the electrical component (15) is not positionally displaced when the electrical component (15) is heated and pressed.

Description

technical field [0001] The present invention relates to a mounting method for mounting electrical components on a substrate. Background technique [0002] Conventionally, adhesives have been used for mounting electrical components such as semiconductor elements. [0003] When the electrical component is mounted using an adhesive, the adhesive is sandwiched between the substrate and the electrical component, and the pressing head is pressed against the electrical component to press. [0004] As the pressing head, a hard head such as metal or ceramic is often used, but an elastic body head having an elastic body (pressing rubber) such as silicon rubber (silicon rubber) is also used. When the pressing rubber of the elastomer head is pressed against the electric part, air bubbles (voids) of the adhesive are better avoided than when a hard head is used, so the connection reliability between the electric part and the substrate can be improved sex. [0005] However, in the mount...

Claims

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Application Information

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IPC IPC(8): H01L21/60H05K3/32
CPCH01L2224/83851H01L2924/01015H01L2924/0781H01L2924/01004H01L2224/75315H01L2224/16H01L2224/83874H01L2924/01019H01L2224/293H01L2224/83192H01L2924/01027H05K2201/10674H01L2224/32225H01L2924/0665H01L2224/2919H01L2224/7598H01L2224/75252H05K3/305H01L2224/2929H01L2224/83871H01L2924/19043H01L2224/73204H01L2224/83885H01L2224/75251H01L2924/14H01L24/83H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H01L2224/83859H01L24/31H01L2224/83862H01L2924/01078H05K3/323H01L2924/10253H01L2224/16225H01L24/75H01L2924/00011H01L2924/00014H01L2924/12042Y02P70/50H01L2924/00H01L2224/0401H05K3/32
Inventor 古田和隆蟹泽士行谷口雅树
Owner DEXERIALS CORP