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Wiring substrate and method of manufacturing the same

A wiring substrate and wiring layer technology, applied in printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased overall thickness, easy deformation of wiring substrates, and inability to obtain mechanical strength, etc. Achieving the effect of size reduction and improved reliability

Inactive Publication Date: 2009-04-01
SHINKO ELECTRIC IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In the above configuration in which the reinforcement members 106 are stacked and fixed on the surface of the wiring member 101, the overall thickness of the wiring substrate 100 is increased, and thus this configuration does not meet the requirement for downsizing.
In addition, when the reinforcing member 106 is thinned to reduce the size of the wiring substrate 100, sufficient mechanical strength (rigidity) cannot be obtained.
Therefore, when an external force is applied, the wiring substrate 100 is easily deformed

Method used

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  • Wiring substrate and method of manufacturing the same
  • Wiring substrate and method of manufacturing the same
  • Wiring substrate and method of manufacturing the same

Examples

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Embodiment Construction

[0032] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0033] Figure 2A and 2B is a schematic diagram of a wiring substrate 1A according to a first embodiment of the present invention. Figure 2A is a cross-sectional view of the wiring board 1A, Figure 2B It is a plan view of the wiring board 1A.

[0034] The wiring substrate 1A according to the present embodiment is mainly composed of a wiring member 30 and a reinforcing member 50 . As will be described in detail later in the steps of manufacturing the wiring substrate 1A, the wiring member 30 is constituted by laminating the insulating layers 20, 20a, 20b and the wiring layers 18, 18a, 18b, 18c (see Figure 5C ).

[0035] Solder bumps 29 connected to the first wiring layer 18 (hereinafter also referred to as “connection pad 18 ”) serving as the first connection terminal C1 are provided on the surface 30 a of the wiring member 30 . Furthermor...

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Abstract

There is provided a wiring substrate. The wiring substrate includes: a wiring member formed by layering wiring layers and insulating layers; and a frame-like stiffening member having an opening therein. The wiring member is arranged in the opening, and an inner wall of the opening and an outer peripheral side wall of the wiring member are adhered with an adhesive member.

Description

technical field [0001] The present invention relates to a wiring board and a manufacturing method thereof. More specifically, the present invention relates to a wiring substrate formed by disposing a reinforcing member on a wiring member formed by forming a wiring layer and an insulating layer on a supporting member, and a method of manufacturing the same, and a method for manufacturing the same, wherein Formed by removing supporting parts. Background technique [0002] For example, as a method of manufacturing a wiring substrate on which electronic components are mounted, there is a known method in which a desired wiring layer is formed on a supporting member in a state where the wiring layer can be peeled off from the supporting member, and then The wiring layer is separated from the supporting member, thereby forming a wiring substrate. In such a wiring board manufacturing method, a supporting member is present when forming a build-up wiring layer. Therefore, the build...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH05K1/0271H05K3/4644H01L23/49816H05K2201/09136H01L23/49833H01L23/13H01L2224/73204H01L2224/16225H05K2201/2018H01L2924/09701H01L2224/48227H01L2224/32225Y10T29/49155H01L2924/00H05K3/22H05K3/40H05K3/46
Inventor 松元俊一郎
Owner SHINKO ELECTRIC IND CO LTD
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