Vision inspection apparatus and plate-establishing inspection device and method therefore

Abstract

The invention discloses a visual detecting device and an imbedding plate detecting device which uses a visual positioning device. The detecting device is used for searching and positioning the positions of the sub-plate positioning marks of the upper and lower surfaces of an imbedded sub-plate, thereby comparing the position coordinates of the positioning marks of the sub-plate positioning marks so as to find out whether the position coordinates exceed a pre-set value. If the coordinates exceed the pre-set value, the coordinates are abandoned. A position detecting device is used for searching and positioning the position of a positioning mark of a mother board. And the imbedding sub-plate is placed in the containing space of the mother board by a shifting positioning device according to the position of the positioning mark of the mother board.

Description

technical field [0001] The present invention relates to a visual detection device, planting board detection device and method thereof, in particular to a visual positioning device to judge whether a sub-board and a main board are a qualified product, and then correctly set the sub-board in the accommodating space of the motherboard. Background technique [0002] In order to increase production capacity, current electronic product manufacturers mostly combine the printed circuit boards (that is, daughter boards) of several products into one motherboard, so that when electronic components are installed later, multiple daughter boards can be targeted at the same time on one motherboard. The plates are processed in the same process. However, for printed circuit board manufacturers, these sub-boards in the same motherboard cannot be all flawless sub-boards, and electronic product manufacturers are mostly unwilling to accept defective sub-boards in the motherboard in order to sav...

AI Technical Summary

Problems solved by technology

However, the insertion of the motherboard and the sub-board is manually bonded, which is time-consuming and labor-intensive and increases the cost. But most importantly, because the motherboard and the sub-board are aligned with the mold, the sub-board cannot It is exactly the same as the position of the excavated sub-board, and its position error will cause the electronic components to be unable to set their predetermined positions correctly during subsequent production, especially for increasingly sophisticated circuit design, which will cause the circuit of electronic products to In case of failure such as short circuit

[0004] As can be seen from the above, the above-mentioned known planting methods are obviously inconvenient and have defects, which need to be improved

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