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Method and apparatus for combinatorially varying materials, unit process and process sequence

A technology of process sequence and unit process, applied in the direction of metal material coating process, material inspection product, application, etc., can solve the problems of high cost, long time, few data points, etc.

Inactive Publication Date: 2009-04-29
INTERMOLECULAR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thus, uniform processing across the wafer under conventional processing techniques results in fewer data points per substrate, longer time required to collect a large amount of various data, and higher costs associated with obtaining such data

Method used

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  • Method and apparatus for combinatorially varying materials, unit process and process sequence
  • Method and apparatus for combinatorially varying materials, unit process and process sequence
  • Method and apparatus for combinatorially varying materials, unit process and process sequence

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Embodiment Construction

[0021] Embodiments described herein provide methods and systems for evaluating materials, unit processes, and process integration sequences to improve semiconductor manufacturing processes. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known processes have not been described in detail in order not to unnecessarily obscure the present invention.

[0022] Embodiments described herein enable the application of conjoint techniques in process sequence integration in order to achieve the desired effect by considering the unit fabrication process, the process conditions that typically affect such unit fabrication process, and the material properties of the components utilized in the unit fabrication process. The semiconductor manufacturing process that achieves the global optimal sequence through the mutual influence among them. Rather than considering only ...

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Abstract

A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.

Description

Background technique [0001] The fabrication of integrated circuit (IC) semiconductor devices, flat panel displays, optoelectronic devices, data storage devices, magnetoelectronic devices, magneto-optical devices, packaged devices, etc. requires the integration and sequencing of many unit process steps. For example, IC fabrication typically includes a series of processing steps such as cleaning, surface preparation, deposition, photolithography, patterning, etching, planarization, implantation, thermal annealing, and other related unit processing steps. The precise sequence and integration of the unit processing steps can result in a functional device that meets the required performance specifications such as speed, power consumption, yield and reliability. Moreover, equipment and apparatus used in device fabrication have been evolving to enable processing once increased in order to accommodate more ICs per substrate per unit processing step for reasons of productivity and cost...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/52G01N33/20H01L21/66G01R31/26A23B4/12A23J3/34
CPCB01J2219/0043B01J2219/00659H01L21/76849B01J2219/00443B01J2219/0075B01J19/0046B01J2219/00536
Inventor 托尼·P·江戴维·E·拉佐夫斯凯库尔特·魏纳格斯·平托托马斯·布西埃萨莎·格雷尔
Owner INTERMOLECULAR