Land grid array packaged device and method of forming same
一种集成电路、夹具的技术，应用在半导体/固态器件零部件、半导体器件、电气元件等方向，能够解决引线框架和封装组件费钱、耗时等问题
Active Publication Date: 2009-04-29
NXP USA INC
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, forming the lead frame and package assembly is expensive and time consuming if chemical etching or etch back is required
Method used
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[0027] The following detailed description in conjunction with the accompanying drawings is used to illustrate the preferred embodiments of the present invention, and does not mean that the present invention only uses these forms. It should be understood that the same or equivalent functions can be realized by other embodiments included within the spirit and scope of the present invention.
[0028] Referring now to FIG. 1 , shown is an enlarged cross-sectional view of a packaged semiconductor device 10 formed in accordance with one embodiment of the present invention. The packaged device 10 includes an integrated circuit die 12 , eg, a die cut from a silicon wafer, which is attached to one or several soft balls 14 with a die attach material 16 . The integrated circuit die 12 has a top surface, ie, a first surface 18 , with a plurality of wire bond pads 20 . The wire pads 20 are electrically connected to other soft balls 14 . Preferably, the wire pads 20 are connected to the s...
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A method of packaging an integrated circuit die ( 12 ) includes the steps of forming an array of soft conductive balls ( 14 ) in a fixture ( 30 ) and flattening opposing sides of the balls. The flattened balls are then transferred from the fixture to a mold masking tape ( 36 ). A first side of the IC die is attached to the balls with a die attach adhesive ( 16 ) and then wire bonding pads ( 20 ) on the die are electrically connected directly to respective balls with wires ( 22 ). An encapsulant ( 24 ) is formed over the die, the electrical connections, and a top portion of the formed balls. The tape is removed and adjacent, encapsulated dice are separated via saw singulation. The result is an encapsulated IC having a bottom side with exposed balls.
Description
technical field [0001] The present invention relates to integrated circuit packaging and, more particularly, to an improved method for fabricating a land grid array (LGA) packaged device. Background technique [0002] Integrated circuit (IC) dies are tiny components formed on semiconductor wafers, such as silicon wafers. A lead frame is a metal frame that usually includes pads that support IC dice cut from a wafer. The lead frame also has lead fingers that provide external electrical connections. That is, the die is connected to the die pad, and then the die pad is connected to the lead fingers by wire bonding or flip chip bumps to provide external electrical connections. Encapsulate the die and wirebonds with protective material or flip chip bumps to form a package. Depending on the package type, the external electrical connections may remain unchanged, such as in a Thin Small Outline Package (TSOP), or be further processed, such as by connecting spherical solder balls f...
Claims
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IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L23/31H01L23/488H01L21/48H01L21/58H01L21/68
CPCH01L2224/48599H01L21/561H01L2924/15311H01L2924/014H01L2924/01029H01L2224/056H01L2224/83194H01L2224/48799H01L2224/45147H01L24/31H01L2924/0132H01L2224/48844H01L2224/29111H01L24/06H01L2924/01079H01L2224/48465H01L2224/48091H01L23/488H01L2224/73265H01L2224/8314H01L2924/157H01L2924/0665H01L2924/01006H01L2224/83136H01L2224/05556H01L2924/14H01L2924/01014H01L2224/97H01L21/568H01L2924/01076H01L24/05H01L24/83H01L24/97H01L2924/0105H01L2224/2919H01L2224/32245H01L2224/4943H01L2224/45144H01L2224/8385H01L2924/01028H01L2924/01033H01L2924/01082H01L24/45H01L2924/01015H01L2924/10253H01L24/49H01L23/3107H01L2224/05644H01L2224/45139H01L2924/01078H01L2224/49171H01L2224/48095H01L2224/48644H01L24/48H01L2924/07802H01L2224/04042H01L2224/48247H01L2924/01047H01L2224/05554H01L2924/181H01L2224/85207H01L2924/00014H01L2924/10162H01L2924/00011H01L2924/00H01L2924/00012H01L2224/13111H01L2224/45015H01L2924/207H01L2924/01049H01L21/50
Inventor 苏海明周伟煌许南
Owner NXP USA INC