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Substrate treatment device, coating device and coating method

A substrate processing device and substrate technology, which is applied to the surface coating liquid device, coating, transportation and packaging, etc., can solve the problems of coating spot, resist coating film thickness change, etc., and achieve mechanism improvement , Improve the coating quality and shorten the takt time of production

Active Publication Date: 2009-05-13
TOKYO ELECTRON LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the front end and the rear end of the board vibrate up and down during floating transfer, or when the board is bent into a mountain shape in a direction perpendicular to the transfer direction, the suction pads and connecting parts holding the board also vibrate or change up and down along with the board. If the position is changed, the substrate cannot be held or corrected in a certain posture suitable for the coating process, and the film thickness of the resist coating film will be changed, which will easily cause coating spots

Method used

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  • Substrate treatment device, coating device and coating method
  • Substrate treatment device, coating device and coating method
  • Substrate treatment device, coating device and coating method

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Embodiment Construction

[0080] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0081] FIG. 1 shows a coating development processing system as an example of the configuration of a substrate processing apparatus, a coating apparatus, and a coating method to which the present invention can be applied. The coating and developing processing system 10 is set in a clean room, for example, a rectangular glass substrate is used as the substrate G to be processed, and cleaning, resist coating, prebaking, developing and processing in the photolithography process are performed in the LCD manufacturing process. A series of treatments such as post-baking. Exposure processing is carried out by an external exposure device 12 provided adjacent to the system.

[0082] The coating and development processing system 10 is equipped with a horizontally long processing station (P / S) 16 at the center, and a cassette station (C / S) 14 and an interface at both end...

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Abstract

The invention provides a substrate processing apparatus and a coating apparatus and a coating method characterized in that a rectangular processed substrate is kept a fitting processed posture as a simple structure for stably suspending moving on a suspension loading station. A first and a second holding parts (106L, 106R) in a first (left side) and a second (right side) moving parts (84L, 84R) comprise two adsorption pads (108L, 108R) combined at the reverse (low surface) of the two corners at left side and right side of the substrate G through a vacuum adsorption force; a pair of pad support parts (110L, 110R) for inhibiting the displacement in perpendicular direction of each adsorption pad (108L, 108R) in two positions which are separated by a prescriptive space along the moving direction (X direction); and a pair of pad actuators (112L, 112R) enabling the pad support parts (110L, 110R) to respectively independently up-down moving or up-down shifting.

Description

technical field [0001] The present invention relates to a substrate processing apparatus of a levitation transport system, and more particularly to a coating device and a coating method for transporting a substrate to be processed while being suspended on a stage, and coating a processing liquid on the substrate. Background technique [0002] In the photolithography process of the manufacturing process of flat panel displays (FPDs) such as LCDs, the process of scanning a long resist nozzle with a gap-shaped discharge port and coating a resist solution on the substrate to be processed is often used. Spin-free application method. [0003] As one form of such a non-rotational coating method, the following floating transfer method is known. For example, as disclosed in Patent Document 1, it is used to support a rectangular substrate to be processed (such as a glass substrate) for FPD The object stage is constructed as a suspension type, and the substrate is kept floating in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/677H01L21/027B65G49/06G03F7/16B05C13/02B05C5/00B05D1/00
CPCB05C5/02B05C13/02G03F7/16H01L21/027H01L21/683
Inventor 筱崎贤哉大塚庆崇中满孝志池本大辅三根阳介
Owner TOKYO ELECTRON LTD
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