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Manufacturing method for semiconductor device

A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as poor consistency of process results, and achieve the effects of shortening process cycle, improving accuracy, and improving overall control.

Inactive Publication Date: 2012-05-23
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The invention provides a method for manufacturing a semiconductor device to improve the poor control of each step of the process and the poor consistency of process results in the existing semiconductor manufacturing process

Method used

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  • Manufacturing method for semiconductor device
  • Manufacturing method for semiconductor device
  • Manufacturing method for semiconductor device

Examples

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no. 1 example

[0091] The first embodiment of the present invention comprehensively considers the characteristics of the production equipment between the two-step processes, so as to control the progress of the process well. In this embodiment, the prior process is to deposit a thin film on a substrate with grooves on the surface, and the subsequent process is to planarize the thin film by chemical mechanical polishing.

[0092] Figure 5 It is a flow chart of the first embodiment of the manufacturing method of the semiconductor device of the present invention, which is combined with the following Figure 5 Describe in detail the specific implementation steps of the first embodiment of the present invention:

[0093] Step 501 : Process the substrates separately using different production devices of the prior process.

[0094] In this embodiment, the equipment used for depositing the thin film in the prior process may be any one of a plurality of chemical vapor deposition equipment. For th...

no. 2 example

[0126] The second embodiment of the present invention comprehensively considers the characteristics of the production equipment among the multi-step processes, so as to control the progress of the process well. In this embodiment, the first process is to planarize the thin film by chemical mechanical polishing; the second process is to deposit the thin film by chemical vapor deposition, and the third process is to planarize the thin film by chemical mechanical polishing.

[0127] Figure 11 It is a flow chart of the second embodiment of the manufacturing method of the semiconductor device of the present invention, which is combined with the following Figure 11 Describe the specific implementation steps of the second embodiment of the present invention in detail:

[0128] Step 1101: Process the substrates separately by using different production devices of the first process.

[0129] In this embodiment, the first process is a chemical mechanical polishing process, and the eq...

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Abstract

The invention discloses a manufacturing method for semiconductor devices, which comprises steps of utilizing at least one procedure of employing different production devices to respectively process a substrate, respectively detecting results of the different production devices in the prior art, respectively combining the different production devices in the prior art to obtain various combined process results of different production device combinations, finally, respectively defining processing conditions adapted to the follow-up processes under the different production device combinations according to the various combined process results. The manufacturing method for semiconductor device integrally take different characteristics of the production devices used in the prior art and the production device used in the follow-up process into consideration, thereby increasing control force to each procedure in the semiconductor device manufacturing process and accuracy of the processing results.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a method for manufacturing a semiconductor device. Background technique [0002] The integrated circuit manufacturing process is a planar manufacturing process that combines various processes such as lithography, etching, deposition, ion implantation, etc. to form a large number of complex devices of various types on the same substrate, and interconnect them to have a complete electronic functions. Among them, the deviation of any step of the process may cause the performance parameters of the circuit to deviate from the design value. [0003] However, in actual production, there are many factors that affect the results of the process. Taking the chemical mechanical polishing process as an example, it can be mainly divided into two categories: one is the influence of the prior process deviation on the process results, such as the difference in the de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 姚宇王亦磊江思明
Owner SEMICON MFG INT (SHANGHAI) CORP