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Manufacturing method for thin-film circuit or thin-film switch

A technology of membrane switch and manufacturing method, applied in the direction of multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, circuits, etc.

Inactive Publication Date: 2010-09-08
SHANGHAI YIDIAN ELECTRONICS PRINTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a method for manufacturing a thin film circuit board or a membrane switch, aiming at the problem that the existing manufacturing methods of the thin film circuit board or the membrane switch cannot meet the needs of miniaturization, digitalization, intelligence and multi-functional development of electronic products. Conveniently realize the requirement of double-sided wiring of membrane circuit or membrane switch

Method used

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  • Manufacturing method for thin-film circuit or thin-film switch
  • Manufacturing method for thin-film circuit or thin-film switch
  • Manufacturing method for thin-film circuit or thin-film switch

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing and specific implementation method, the present invention is described in further detail:

[0013] As shown in Figure 2, the schematic diagram of the electrical connection steps of the conductive circuit:

[0014] (1) First print the corresponding electrical connection points of the conductive circuit 2 on the front surface of the film substrate 5, as shown in A in FIG. 2 .

[0015] (2) puncture and cut with a needle-shaped tool at the electrical connection point of the film substrate 5, so that the film substrate penetrates the penetration hole 4 as shown in B in Figure 2;

[0016] (3) Then, the conductive circuit 1 is printed on the reverse side of the film substrate 5, as shown in C in Figure 2, the conductive ink is embedded and penetrated through the corresponding electrical connection point penetration hole 4 under the scraping pressure during printing, so that it is compatible with The electrical connection points o...

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PUM

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Abstract

The invention relates to a manufacturing method for film circuits or film switches, the steps of the manufacturing method comprise painting conducting wires on two surfaces of a film substrate of a film circuit or a film switch respectively through screen painting, penetrating and cutting the film substrate through an aciform tool or a tool in other shape, painting and filling electrically conductive ink at the penetrating cutting position, and enabling the conducting wires of the two surfaces of the film substrate to be communicated and connected electrically. The invention relatively conveniently realizes requirements of double-surface wiring of film circuits or film switches.

Description

technical field [0001] The invention relates to a switch technology used for input and display in electronic and electrical equipment. Specifically, it relates to a manufacturing method of a thin film circuit board or a thin film switch. Background technique [0002] With the development of information technology, the appearance of various electronic products is becoming lighter, thinner and miniaturized, and the switching functions are more and more. Some electronic equipment switch matrix layout is very dense, and LED display components are required. This brings higher requirements for the wiring of membrane circuit boards or membrane switches. The current method generally adopts the wiring method of bridging jumpers. Because the bridging is wired on one side, there is still space limitation, which limits the wiring space. . The new method conforms to the needs of miniaturization, digitization, intelligence and multi-functional development of electronic complete products...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/70H05K3/46
Inventor 杨恺周鹏飞
Owner SHANGHAI YIDIAN ELECTRONICS PRINTING TECH