Radiating module

Abstract

The invention discloses a heat-radiation module for cooling microprocessors, which comprises a base, a diversion tube, a plurality of heat-conducting fins and fans. The base is arranged on the microprocessor, the diversion tube is connected with the base for guiding the direction of flow and has heat-insulation tube walls, wherein, the heat-insulation tube walls separate the diversion tube into the internal portion and the external portion and can delay the heat conductivity of the diversion tube along the direction of guiding flow, a plurality of heat-conducting fins are fixed on the heat-insulation tube walls, each two adjacent heat-conducting fins are isolated through the heat-insulation tube walls of the diversion tube, a plurality of heat-conducting fins have direction of heat-radiation, are intersected with the direction of guiding flow, and direct to the external portion from the internal portion of the diversion tube. The fans are assembled at the external portion of the diversion tube for providing cooling air flown to these heat-conducting fins. The heat-radiation module of the invention has lighter weight, which can not only improve the heat-radiation efficiency, but also can lower the material cost of the diversion tube.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module for cooling a microprocessor. Background technique [0002] As the speed of the central processing unit (CPU) of the computer is getting faster and faster, the volume required by the market is getting smaller and smaller, and the traditional heat dissipation technology of "heat sink + fan" can no longer meet the demand. In order to solve the problem of heat transfer, solutions such as "heat pipe + heat sink + fan" and "water-cooled heat dissipation module" have been developed, and the "water-cooled heat dissipation module" is used as an example to illustrate the following. [0003] Please refer to Figure 1A , is a side view of a known water-cooled heat dissipation module 100 . The cooling module 100 is connected to a water pump 200 and a heat source, such as a CPU 300 . The cooling module 100 includes a copper tube 120 , a plurality of cooling fins 140 , a...

AI Technical Summary

Problems solved by technology

In this way, the water temperature at the upstream end 124 is reduced, and the water temperature at the downstream end 126 is increased, so that the temperature difference between the upstream and downstream ends 124, 126 is reduced, so the heat transfer efficiency of the heat sink 140 will be deteriorated.

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