Semiconductor encapsulation conformation and used substrate thereof

Abstract

The invention relates to a semiconductor packaging structure and base plate used thereby. The semiconductor packaging structure comprises a base plate which has a plurality of signal joint-fingers, a fictitious metal graph and at least a peripheral notch groove penetrating the base plate, a chip which is arranged on the base plate and has a plurality of welding cushions, a plurality of electrically connected elements for connecting the welding cushions of the chip and the signal joint-fingers of the base plate, and a sealed colloid body which is to seal the electrically connected elements and is filled in the peripheral notch groove. The fictitious metal graph extends the trimming to the peripheral notch groove and is electrically insulated from the signal joint-fingers, the base plate has a plurality of signal joint-fingers, the fictitious metal graph and at least a peripheral notch groove penetrating the base plate. Because the peripheral notch groove is favorable for mold flow to fill and reduce the excessive glue of mold seals and the shape of the trimming of the fictitious metal graph to the peripheral notch groove, the invention can inhibit the lateral warping amplitude of the base plate, lower the fracture probability produced by the base plate, and enhance the thermal stress resistance of the peripheral notch groove under the circulation of temperature, thereby avoiding the surface or the lateral sides of the chip from damaging.

Description

technical field [0001] The present invention relates to a window-type semiconductor package structure and its substrate, in particular to a window-opening peripheral, which facilitates mold flow filling and reduces mold overflow, can suppress the warpage of the side of the substrate and reduce the probability of substrate fracture, and can The semiconductor package structure and the substrate used to avoid damage to the surface or side of the chip. Background technique [0002] In the field of integrated circuit packaging, a window type semiconductor package structure (Window type semiconductor package) is to open a through window on the circuit substrate used to carry the chip, so as to allow metal bonding wires or known electrical connection elements to pass through. through the window to electrically connect the substrate and the chip. However, the shape of the conventional window at the center of the substrate should be a long and narrow slot to expose a plurality of ce...

AI Technical Summary

Problems solved by technology

Since the shape of the peripheral small windows 113 is square or rectangular, and its size is much smaller than the central slot 117, the side structure of the substrate 110 will not be weakened excessively, but a large number of peripherals are required in manufacturing. The small window 113 not only makes the hole shape difficult, but also increases the manufacturing cost of the substrate

In addition, the mold flow forming the molding compound 140 is not easy to fill the peripheral small windows 113, and there is a problem of mold overflow

[0005] It can be seen that the above-mentioned existing semiconductor packaging structure and the substrate used therein obviously still have inconvenience and defects in structure and use, and need to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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