Airflow guiding structure

Abstract

An airflow guidance structure is applied to an electronic device comprising a base and a control box; the control box is inserted in the base, wherein, the base is provided with a first connection part concavely arranged at the upper end; the control box is provided with a box body, a heating source arranged inside the box body, and a second connection part arranged at the lower end of the box body and used for combining the first connection part; and the airflow guidance structure comprises an airflow inlet and an airflow outlet separately formed on the base and the control box, so as to form a chimney-type airflow channel. Therefore, the invention achieves the better radiating effect under the condition that the volume of the electronic device is not increased.

Description

technical field [0001] The invention relates to an airflow guiding technology, more specifically, an airflow guiding structure applied to an electronic device. Background technique [0002] The heat dissipation problem of an electronic device has become the main factor determining the performance and quality of the electronic device. Therefore, in an electronic device, a heat dissipation system with better heat dissipation performance will undoubtedly be more popular. At the same time, usually when designing and producing these electronic devices, in order to improve heat dissipation efficiency, corresponding designs are carried out on the interior and appearance of these electronic devices. [0003] In traditional heat dissipation methods, heat dissipation units such as heat sinks, heat pipes, and fans are installed at positions corresponding to heat sources in electronic devices. The housing of the housing is provided with heat dissipation holes corresponding to the above...

AI Technical Summary

Problems solved by technology

[0004] For example, for electronic devices such as audio-visual devices and compact computers (computers), the size of the electronic devices is required to be as small as possible for the convenience of portability; overall volume

At the same time, if a smaller heat dissipation unit is used, although it can save a certain amount of space, it will not only increase a lot of cost, but also make the electronic device have more internal components, and the structure is relatively more complicated.

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