Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus

Abstract

A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

Description

technical field [0001] The present invention relates to a component mounting substrate, a manufacturing method thereof, a semiconductor module, a manufacturing method thereof, and a portable device. Background technique [0002] The high performance of portable electronic devices such as mobile phones, PDAs, DVCs, and DSCs is accelerating. In order for such products to be accepted by the market, they must be miniaturized and lightweight. Therefore, semiconductor modules such as multi-chip modules (MCMs) used in these electronic devices are also required to be miniaturized. In this regard, there is known a semiconductor device in which active elements such as semiconductor chips and passive elements such as capacitors are covered by an insulating layer formed on a substrate, and the active elements and passive elements are connected via the insulating layer and the insulating layer-like wiring. connect. [0003] In addition, in recent years, along with miniaturization and p...

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Problems solved by technology

[0004] However, in conventional semiconductor devices, since passive elements such as capacitors are mounted on silicon substrates as separate components, there is a problem that miniaturization of semiconductor devices is suppressed and the number of manufacturing steps increases.

[0005] In addition, in the structure in which the element mounting substrate and the semiconductor element are integrated via an insulating resin, and the protrusion structure provided on the wiring layer is connected to the electrode of the semiconductor element, the adhesion between the insulating resin and the semiconductor element is not high.

Therefore, there is a possibility that the insulating resin may peel off from the semiconductor element due to thermal stress due to temperature changes in the use environment, etc., for example.

In particular, as shown in the above-mentioned conventional structure, when the intervals between the protrusion structures penetrating the insulating resin are wide, the insulating resin is easily peeled off from the semiconductor element between the protrusion structures.

Moreover, when the insulating resin is peeled off from the semiconductor element, the adhesion between the protrusion structure and the electrode of the semiconductor element is reduced, and as a result, the connection reliability between the protrusion structure and the electrode of the semiconductor element may be reduced.

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