Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus

A technology for installation and components, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., which can solve the problems of insulating resin peeling, increased number of manufacturing processes, and low adhesion between insulating resin and semiconductor components

Inactive Publication Date: 2009-07-29
SANYO ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in conventional semiconductor devices, since passive elements such as capacitors are mounted on silicon substrates as separate components, there is a problem that miniaturization of semiconductor devices is suppressed and the number of manufacturing steps increases.
[0005] In addition, in the structure in which the element mounting substrate and the semiconductor element are integrated via an insulating resin, and the protrusion structure provided on the wiring layer is connected to the electrode of the semiconductor element, the adhesion between the insulating resin and the semiconductor element is not high.
Therefore, there is a possibility that the insulating resin may peel off from t...

Method used

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  • Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus
  • Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus
  • Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0045] 1 is a schematic cross-sectional view showing the structure of a component mounting substrate 10 and a semiconductor package 30 using the same according to Embodiment 1. As shown in FIG. The semiconductor package 30 has a substrate 10 for mounting an element and a semiconductor element 50 mounted on the substrate 10 for mounting an element.

[0046] The component mounting substrate 10 has: an insulating resin layer 12 formed of an insulating resin; a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12; electrically connected to the wiring layer 14 and insulated from the wiring layer 14; A plurality of protruding electrodes 16 protruding from the side of the resin layer 12 . In addition, the component mounting substrate 10 has a counter electrode 18 provided on the other main surface S2 of the insulating resin layer 12 at positions corresponding to the plurality of protruding electrodes 16, and has a top portion corresponding to the protrudin...

Embodiment approach 2

[0073] In Embodiment 1 above, the insulating resin layer 12 is sandwiched between the copper plate 13 and the counter electrode 18 or the semiconductor element 50, and the insulating resin layer 12 is press-molded to integrate them to form the element mounting substrate 10 or the semiconductor package 30. However, The element mounting substrate 10 or the semiconductor package 30 may also be formed as follows. This embodiment will be described below. The method of forming the protruding electrodes 16 is the same as that of the first embodiment. In addition, the same reference numerals are assigned to the same configurations as those in Embodiment 1, and description thereof will be omitted.

[0074] Figure 5 (A)~(F) and Figure 6 (A) to (C) are process cross-sectional views showing a method of bonding the protruding electrode 16 to the counter electrode 18 or the element electrode 52 .

[0075] Such as Figure 5 As shown in (A), on the main surface of the copper plate 13 o...

Embodiment approach 3

[0086] In the configurations of Embodiments 1 and 2, the insulating resin layer 12 is present between the protruding electrode 16a and the opposing electrode 18a or the element electrode 52a. A dielectric film layer having a dielectric constant larger than that of the insulating resin layer 12 is provided between the electrodes 18a or the element electrodes 52a. This embodiment will be described below. Incidentally, the method of forming the protruding electrodes 16 is the same as that of the first embodiment. In addition, the same code|symbol is attached|subjected to the same structure as Embodiment 1 or 2, and description is abbreviate|omitted.

[0087] Figure 7 (A)~(G) and Figure 8 (A) to (E) are process cross-sectional views showing a method of bonding the protruding electrode 16 to the counter electrode 18 or the element electrode 52 .

[0088] Such as Figure 7 As shown in (A), the dielectric film 20 is formed on the entire main surface of the copper plate 13 on t...

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Abstract

A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

Description

technical field [0001] The present invention relates to a component mounting substrate, a manufacturing method thereof, a semiconductor module, a manufacturing method thereof, and a portable device. Background technique [0002] The high performance of portable electronic devices such as mobile phones, PDAs, DVCs, and DSCs is accelerating. In order for such products to be accepted by the market, they must be miniaturized and lightweight. Therefore, semiconductor modules such as multi-chip modules (MCMs) used in these electronic devices are also required to be miniaturized. In this regard, there is known a semiconductor device in which active elements such as semiconductor chips and passive elements such as capacitors are covered by an insulating layer formed on a substrate, and the active elements and passive elements are connected via the insulating layer and the insulating layer-like wiring. connect. [0003] In addition, in recent years, along with miniaturization and p...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/48H01L21/58
CPCH01L2924/19041H01L2224/114H01L2224/116H01L2924/13091
Inventor 斋藤浩一冈山芳央高野洋中里真弓
Owner SANYO ELECTRIC CO LTD
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