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Heater including flexible printed wiring board and method for manufacturing same

A technology of a flexible printed circuit and a manufacturing method, which is applied to the manufacturing of printed circuits, printed circuits, printed circuits, etc., can solve the problems of low thermal conductivity and lack of reliability in the pasted state of the second insulating film 522, and achieves a reduction in the number of manufacturing processes. Effect

Pending Publication Date: 2021-09-28
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thermal conductivity between the heater wire 510 and the vapor chamber 531 is low
In addition, there is also concern that the bonding state of the vapor chamber 531 to the second insulating film 522 lacks reliability.

Method used

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  • Heater including flexible printed wiring board and method for manufacturing same
  • Heater including flexible printed wiring board and method for manufacturing same
  • Heater including flexible printed wiring board and method for manufacturing same

Examples

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Embodiment 2

[0067] Image 6 Example 2 of the present invention is shown. In this embodiment, the configuration of the heater circuit portion is different from that of Embodiment 1 described above. Other structures and functions are the same as in Embodiment 1. The same reference numerals are assigned to the same components, and descriptions thereof are omitted.

[0068] Image 6 It is a plan view showing a heater circuit unit according to Embodiment 2 of the present invention. Also, for the sake of illustration, Image 6 The first intermediate product (product after the etching process) is shown in . In the configuration employed in the present embodiment, the meandering region 121X in the heater circuit portion 121 is provided with the linking portion 127 that short-circuits portions of a plurality of adjacent heater wires, respectively.

[0069] By etching the raw material 100 in the etching step, the connection portion 127 for short-circuiting portions of adjacent heater lines is...

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PUM

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Abstract

The invention provides a heater including a flexible printed wiring board and a method of manufacturing the same. A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Japanese Patent Application No. 2020-056295 filed with the Japan Patent Office on March 26, 2020, the entire contents of which are hereby incorporated by reference. technical field [0003] One aspect of the present invention relates to a heater including a flexible printed circuit board and a method for manufacturing the same. Background technique [0004] Conventionally, film heaters have been used to heat windshields and the like of automobiles. The development of advanced driver assistance systems (ADAS) has been progressing in recent years. In order to prevent the fogging of the lens of the camera used for inspection and the front glass, the necessity of a thin-film heater increases. Below, refer to Figure 7 (a) to (c) of 7 and Figure 8 (a) to (c) of 8 will describe conventionally exemplified film heaters and their manufacturing methods. Figure 7 (a) to (c) of 7 and Fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/34H05B3/02
CPCH05B3/34H05B3/02H05B1/0236H05B3/84H05K1/0212H05K1/0393H05K1/167H05K1/181H05K1/189H05K3/06H05K2201/09263H05K3/363
Inventor 青山隼辅木谷健治
Owner NIPPON MEKTRON LTD
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