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Electronic apparatus, heat radiation fan module thereof

A technology for cooling fans and electronic devices, which is applied to circuits, electrical components, electric solid devices, etc., can solve the problems of frequent overheating of electronic devices and cannot meet the requirements of heat dissipation, so as to improve the heat dissipation effect, reduce overheating, and meet the requirements of heat dissipation. Effect

Active Publication Date: 2009-08-05
PEGATRON
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] However, for electronic devices with ever-increasing performance, the above-mentioned heat dissipation methods have gradually failed to meet the heat dissipation requirements, making the problem of overheating of electronic devices more frequent.

Method used

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  • Electronic apparatus, heat radiation fan module thereof
  • Electronic apparatus, heat radiation fan module thereof
  • Electronic apparatus, heat radiation fan module thereof

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Experimental program
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Embodiment Construction

[0021] see Figure 4 to Figure 6 . Figure 4 It is a schematic diagram of the cooling fan module 6 installed in the electronic device 5 according to a preferred embodiment of the present invention. Figure 5 for Figure 4 The appearance diagram of the cooling fan module 6 in the middle. Figure 6 for Figure 5 An exploded view of the cooling fan module 6 in the middle. The heat dissipation fan module 6 of the present invention is suitable for being installed in various electronic devices that require heat dissipation, such as computer hosts, projectors, and the like. Figure 4 The electronic device 5 shown in is a computer host as an example, but not limited thereto. In other embodiments, the electronic device 5 is preferably a notebook computer.

[0022] Generally speaking, the electronic device 5 is provided with many electronic components (not shown) with different functions, such as central processing unit, display card, storage device and so on. When each electroni...

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PUM

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Abstract

The invention discloses an electronic device and a cooling fan module thereof. The cooling fan module comprises a base, an impeller, a liquid storing device, a water mist generator and a lid. The impeller is arranged in the base; the liquid storing device is arranged at the axle center of the impeller and can contain liquid; the water mist generator is arranged on the liquid storing device and can spay out the liquid in the liquid storing device in the form of water mist so as to absorb the heat in the electronic device; the lid covers the base and is matched with the base to form an air outlet; in addition, the lid is provided with an air inlet. When the impeller rotates, blades of the impeller can drive air flow to suck water mist into the base from the air inlet and exhaust out of the base from the air outlet.

Description

technical field [0001] The present invention relates to a heat dissipating fan module, and in particular to an electronic device and a heat dissipating fan module thereof. Background technique [0002] With the continuous development of electronic technology, electronic components are developing towards miniaturization and high density. Electronic components (such as the central processing unit in a computer) generate more and more heat during operation. If the heat cannot be removed in time, the internal temperature of the electronic device will rise, which will seriously affect the normal operation of the electronic components. At present, it is common to install radiators, heat pipes, etc. on electronic components to assist heat dissipation, and then install fans on the radiators to assemble heat dissipation devices. The airflow generated when the fan is running promotes the rapid dissipation of the heat of the radiator, and then takes away the heat generated by the elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467H01L23/473G06F1/20
Inventor 简劭伦陈俊志吴建逸
Owner PEGATRON
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