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Imaging apparatus chip set and image pickup system

A camera device and chipset technology, applied in image communication, radiation control devices, TV system components, etc., can solve problems such as difficulties, a large number of wiring, and reduce the number of layers of camera chip wiring, so as to reduce manufacturing costs and facilitate manufacturing Effect

Inactive Publication Date: 2011-06-22
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It will be difficult to reduce the number of wiring layers of the camera chip including peripheral circuits
In addition, most of the peripheral circuits are digital circuits, and when such peripheral circuits are installed in the imaging chip, there is a problem that it cannot be miniaturized sufficiently.
[0010] A method of providing a peripheral circuit for driving pixels in a DSP chip without providing the peripheral circuit in the imaging chip is also conceivable, but in this case, there is a problem that a large number of wirings are required to connect the imaging chip and the DSP chip.

Method used

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  • Imaging apparatus chip set and image pickup system
  • Imaging apparatus chip set and image pickup system
  • Imaging apparatus chip set and image pickup system

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Embodiment Construction

[0025] One embodiment of the present invention will be described with reference to the drawings. figure 1 An example of the block configuration of the imaging device chipset according to this embodiment is shown. Such as figure 1 As shown, the imaging device chipset of this embodiment is composed of an imaging chip 11 and a digital signal processing (DSP) chip 12 .

[0026] The imaging chip 11 includes a plurality of unit pixels 21 arranged in a matrix in the photosensitive region 20 , and a part of a peripheral circuit unit 22 that drives the plurality of unit pixels 21 . The peripheral circuit unit 22 formed in the imaging chip 11 has a horizontal scanning unit 23, a vertical scanning unit 24, a horizontal timing signal generating unit 25 that supplies a timing signal to the horizontal scanning unit 23, and a signal read out from the unit pixel 21. Amplifying section 26 for magnification. In addition, the unit pixels 21 may be arranged one-dimensionally. Also, the unit p...

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Abstract

The invention relates to an imaging apparatus chip set and an image pickup system. An imaging apparatus chip set is provided with an imaging chip (11) having a plurality of unit pixels (21) and at least a part of a peripheral circuit section (22); and a DSP chip (13) having a digital processing section (31) for performing conversion processing to an imaging signal and the reset of the peripheral circuit section (22). On a first substrate, a first wiring layer is formed. The first wiring layer is of not more than two layers in a photosensitive region (20) wherein the unit pixels (21) are arranged, and is of not more than three layers in other regions.

Description

technical field [0001] The present invention relates to a chip set for an image pickup device and an image pickup system, and particularly relates to a chip set including a MOS type image pickup chip and a digital signal processing chip used in a digital camera or the like, and an image pickup system using the chip set. Background technique [0002] In recent years, along with the improvement in performance and miniaturization of semiconductor devices, one-chip (one-chip) integration of various functions in one chip has been promoted. In the field of solid-state imaging devices, also due to the rapid progress of digital signal processing technology and CMOS microfabrication technology, the following single-chip CMOS camera can be realized. The single-chip CMOS camera is integrated on a silicon substrate. An imaging element that converts the optical signal to the imaging surface into an electrical signal and takes it out, and a digital signal processing device (DSP) capable o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/378H04N5/374H04N5/341H01L27/146H04N5/369H04N5/335H04N25/00
CPCH04N5/378H01L27/14643H04N5/335H04N5/341H01L27/14636H01L27/14627H04N25/00H04N25/40H04N25/75
Inventor 松长诚之
Owner PANASONIC CORP