Thermally conductive grease

A technology of grease and thermally conductive particles, used in the petroleum industry, semiconductor devices, thickeners, etc.

Inactive Publication Date: 2009-08-19
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal or "thermal management" becomes an even greater

Method used

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  • Thermally conductive grease
  • Thermally conductive grease

Examples

Experimental program
Comparison scheme
Effect test

example

[0047] Bulk thermal conductivity

[0048] Bulk thermal conductivity is typically determined on TCG samples according to ASTM D-5470-01 using a heat transfer tester from Custom Automation, Inc., Blaine, MN. The heat transfer tester was constructed in accordance with Proposal Number 3M-102204-01 and included the following components: Vision system capable of measuring parallelism and gap between copper gauge rods up to 0.010 inches (0.254mm) gap; copper gauge Rods with 5 Resistance Temperature Detector (RTD) sensors on each meter rod; coolers for cooling the cold adjustable compact (used to hold the cold meter rods) with an operating range of -20 to 100°C , and can maintain the coolant temperature to + / -0.02°C; 251bF load cell, installed on the X-Y micron adjustment position stage; cold adjustable pressure block (used to fix the cold instrument rod), installed on the load cell ; Thermally adjustable briquetting (used to fix the thermal instrument rod), heated by a thermal res...

test ( example 75-85

[0051] Set the heater set point at 120°C and the cooler set point at -5°C, then allow the elements to equilibrate. The instrument bar gap after thermal equilibration was mechanically adjusted to about 400 microns. The surfaces of the hot and cold rods were brought coplanar using the turnbuckles of each rod until the gap between the rods read by each of the three independent cameras fell within + / - 3 μm.

[0052] The excess of each tested TCG sample was placed on the surface of the hot gauge stick and smoothed over the entire surface. The head is then closed and clamped in place by pressing down on the head with about 10 lbs of force (4.5 kg force), allowing excess TCG sample to seep out of the gauge stick gap until it reaches the mechanical stop. Wipe off the excess TCG with a paper towel or muslin and clean the pins of the gauge stick to facilitate accurate gap measurement by the three vision cameras. Allow the meter to equilibrate for approximately 10 minutes before contin...

example 1

[0083] The compositions of Examples 1 to 64 are shown in Table 1. The compositions of Examples A to N and 65 to 74 are shown in Table 2. Table 3 shows the data obtained from bulk thermal conductivity and thermal impedance measurements performed for selected examples. Table 4 shows viscosity data for selected examples.

[0084] Table 1

[0085] example

[0086] example

[0087] example

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[0090] example

[0091] example

[0092] example

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Abstract

The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other average particle sizes by at least a factor of five. The thermally conductive greases of the invention exhibit desirable theological behavior during installation/ application and during use of devices involving these materials.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority to US Provisional Patent Application No. 60 / 824,599, filed September 5, 2006, the disclosure of which is incorporated herein by reference in its entirety. Background technique [0003] The present invention relates to thermal interface materials and their use. [0004] The computer industry is constantly advancing towards higher computing power and speed. Microprocessors are being made smaller and smaller to increase computing speed. Consequently, power flow is increased and more heat is generated per unit area of ​​the microprocessor. Thermal or "thermal management" becomes an even greater challenge as the heat output of microprocessors increases. [0005] One aspect of thermal management known in the industry as a "thermal interface material" or "TIM," is a material placed between a heat source (such as a microprocessor) and a heat sink to facilitate heat transfer. Su...

Claims

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Application Information

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IPC IPC(8): C10M125/26
CPCC10M113/12C10M2207/126C10M113/06C10N2220/08C10M2201/105C10M2219/044C10M2201/1056C10M2201/0626C10M2209/084C10M2207/289C10M171/06C10M2207/283C10M2201/061C10M113/02C10M2215/221C10M2201/041C10M2201/056C10M2201/0416C10M113/00C10M169/02C10M2207/282C10M2207/285C10N2240/20C10M2209/104C10M2201/05H01L2924/0002C10M2201/0616C10N2250/10C10N2220/082C10M2207/30C10M2215/14C10M2227/04C10M2209/102C10M2201/062C10M113/08C10N2020/06C10N2040/14C10N2050/10C10N2020/055C10M2209/109H01L2924/00C10N2010/02C10M169/04C10N2030/04
Inventor 菲利普·E·肯德尔拉维·K·苏拉
Owner 3M INNOVATIVE PROPERTIES CO
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