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Heat dissipating device

A technology of cooling device and radiator, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of inability to meet the heat dissipation requirements of electronic components, increase heat dissipation area and heat dissipation capacity, and increase heat exchange The effect of improving the capacity and heat dissipation performance

Inactive Publication Date: 2012-05-16
FU ZHUN PRECISION IND SHENZHEN +1
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  • Description
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  • Application Information

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Problems solved by technology

However, with the improvement of the performance of electronic components, more and more electronic components need to be dissipated, and their calorific value has also increased significantly. However, due to the limitation of the overall space of the microcomputer system, the above heat dissipation device can no longer meet the heat dissipation requirements of electronic components.

Method used

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Examples

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Embodiment Construction

[0012] see figure 1 and Figure 4 , the heat dissipation device of the present invention is placed in a case 90 to dissipate heat for the electronic components installed in the case 90 . The case 90 has three adjacent side walls: a first side wall 700, a second side wall 800, and a third side wall 900. The three side walls are respectively provided with a first vent 702, a second vent 802, a third vent A vent 902 , the second side wall 800 is connected to the first side wall 700 and the third side wall 900 . A circuit board 600 is placed in the chassis 90, the central processing unit 300 is arranged on the circuit board 600, the graphics card 400 is installed on the circuit board 600 on the side of the central processing unit 300, the graphics processor 404 is arranged on the graphics card 400, and the circuit A north bridge (not shown) is arranged on the board 600 beside the graphics card 400 . The above-mentioned heat dissipation device includes a first heat sink 100 moun...

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Abstract

A heat dissipating device is used for dissipating heat generated by at least two adjacent electronic elements positioned in a case, and comprises a first radiator positioned in one electronic element. The first radiator comprises a substrate contacted with the corresponding electronic element, and a first fin group formed on the substrate, and also comprises a curved heat tube externally extendedfrom the substrate; the heat tube is provided with a fin combination which extends to a vent of the case through the heat tube; and the first radiator forms a circular structure surrounding another electronic element. The first radiator makes the fin combination extend to the vent of the case through the heat tube, thereby transferring the heat generated by the electronic elements to the fin combination through the heat tube, dissipating the heat by means of low-temperature airflow on the vent, and improving the heat exchange capability between the fin combination and ambient air.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for heat dissipation of electronic components. Background technique [0002] With the maturity of microcomputer development technology, the requirements for improving the performance of microsystems are getting higher and higher. In particular, the performance requirements of electronic components such as high-power central processing units and graphics processors are getting higher and higher, so that the heat generated by electronic components also increases, which seriously threatens the performance of electronic components during operation. In order to ensure the normal operation of electronic components In operation, the heat generated by it needs to be dissipated in time. [0003] A common heat dissipation device for electronic components includes a metal heat-absorbing plate and a plurality of heat-dissipating fins extending from the heat-absorbing pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20
Inventor 刘金标杨红成陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN
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