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Silicone molding plastic for encapsulating high-power electronic component

An electronic component, high-power technology, applied in the field of silicone molding compound, can solve the problems of product failure, component failure, high temperature decomposition of molding compound, etc.

Active Publication Date: 2011-04-06
陕西华星科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such products are used in the packaging of high-power electronic components. When the operating temperature of the device exceeds 200°C, the molding compound will undergo pyrolysis, resulting in component failure and product failure.

Method used

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  • Silicone molding plastic for encapsulating high-power electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] GZ610 type silicone resin 30 parts glass fiber 20 parts

[0022] Silicon dioxide 46 parts Calcium stearate 0.5 parts

[0023] Benzoic acid 0.15 parts Basic lead carbonate 0.15 parts

[0024] 3 parts of ferric oxide

[0025] First, the glass fiber is dewaxed at a high temperature of 300°C; the silicon dioxide is dehumidified; calcium stearate, benzoic acid, and basic lead carbonate are ground;

[0026] Put the silicone resin into the mixer and knead for 5 minutes at 110°C; add glass fiber and silicon dioxide and knead for 10 minutes; add calcium stearate, basic lead carbonate, and ferric oxide and knead for 10 minutes, and wait for mixing Cool and pulverize after uniformity;

[0027] Add the cooled and pulverized material to a mixer for 5 minutes at 110°C, add benzoic acid and knead for 3 minutes, then press the material into flakes, and then pulverize after cooling to obtain high-power electronic component packaging. Keto molding compound.

Embodiment 2

[0029] GZ320 type silicone resin 32 parts glass fiber 20 parts

[0030] Silicon dioxide 44 parts Calcium stearate 0.5 parts

[0031] Benzoic acid 0.15 parts Basic lead carbonate 0.15 parts

[0032] 3 parts ferric oxide

[0033] First, the glass fiber is dewaxed at a high temperature of 300°C; the silicon dioxide is dehumidified; calcium stearate, benzoic acid, and basic lead carbonate are ground;

[0034] Put the silicone resin into the mixer and knead for 5 minutes at 110°C; add glass fiber and silicon dioxide and knead for 10 minutes; add calcium stearate, basic lead carbonate, and ferric oxide and knead for 10 minutes, and wait for mixing Cool and pulverize after uniformity;

[0035] Add the cooled and pulverized material to a mixer for 5 minutes at 110°C, add benzoic acid and knead for 3 minutes, then press the material into flakes, and then pulverize after cooling to obtain high-power electronic component packaging. Keto molding compound.

Embodiment 3

[0037] GZ610 type silicone resin 32.5 parts glass fiber 20 parts

[0038] 20 parts of silicon dioxide 23.5 parts of aluminum oxide

[0039] 0.5 parts of calcium stearate 0.15 parts of benzoic acid

[0040] 0.15 parts of basic lead carbonate 3 parts of ferric oxide

[0041] First, the glass fiber is dewaxed at a high temperature of 300°C; silicon dioxide and aluminum oxide are dehumidified; calcium stearate, benzoic acid, and basic lead carbonate are ground;

[0042] Put the silicone resin into the mixer and knead at 110°C for 5 minutes; add glass fiber, silicon dioxide, and aluminum oxide and knead for 10 minutes; add calcium stearate, basic lead carbonate, and ferric oxide for kneading 10 minutes, after mixing evenly, cool and pulverize;

[0043] Add the cooled and pulverized material to a mixer for 5 minutes at 110°C, add benzoic acid and knead for 3 minutes, then press the material into flakes, and then pulverize it after cooling to obtain high-power electronic component...

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Abstract

The invention relates to a silicone molding plastic used for encapsulating high-power electronic components, comprising the following raw materials by weight proportion: 25-30 portions of organic silicon resin, 20-25 portions of fiberglass, 45-50 portions of metal oxide, 0.5-1 portion of stearate, 0.1-1 portion of benzoic acid, 0.1-1 portion of basic lead carbonate and 1-4 portions of ferroferricoxide. The invention adopts the organic silicon resin having good performance of high-temperature resistance to improve the working temperature of the silicone molding plastic, and the phenomenon of decomposition can not occur, thereby the working performance at high temperature and the working reliability of a power type electric component are improved. The silicon molding plastic has the following parameters: shrinkage factor is 0.3-0. 5 percent, bending strength is 100-110 MPa, resistance is 15*10<12>ohm.cm<3>, ph value is 4-6, specific inductive capacity is 4.4 and fire resistance is UL-94-V-0. The invention is suitable for encapsulating high-power electronic components and fireresistant socket connectors.

Description

1. Technical field [0001] The invention relates to a silicone molding compound used for packaging high-power electronic components, which is a molding compound that can work under high temperature for a long time. The plastic is used in the fields of electronic component packaging, connector packaging, etc. Electronic components protect from the environment, provide structural support and insulating properties. 2. Background technology [0002] At present, the general-purpose electronic component packaging molding compound uses modified epoxy molding compound, and its formula is to use coupling agent, epoxy resin, curing agent, catalyst, silicon powder, flame retardant, colorant, and mold release agent. , stress improver, flow improver and other ingredients are processed through mixing process. During use, the molding compound is preheated, and then molded using a plastic sealing press and a mold. However, such products are used in the packaging of high-power electronic co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K13/04C08K7/14C08K3/22C08K5/098C08K5/09C08K3/26
Inventor 张兴科赵宏涛张晓年王进元
Owner 陕西华星科技股份有限公司
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