Method of manufacturing semiconductor device
A semiconductor and device technology, applied in the field of manufacturing semiconductor devices, can solve problems such as weakening the reliability of semiconductor devices
Inactive Publication Date: 2009-10-07
NITTO DENKO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
As a result, problems similar to the above are caused, thereby impairing the reliability of semiconductor devices
Method used
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Embodiment Construction
[0020] Next, embodiments of the present invention will be described in detail with reference to the drawings hereinafter.
[0021] Figures 1A to 1D , Figures 2A to 2D as well as Figure 3A and 3B An embodiment of a method of manufacturing a semiconductor device of the present invention is schematically shown. In this embodiment, the following steps (1) to (3) are provided.
[0022] (1) A sealing material disposing step in which the sealing material 2 is disposed on the surface of the semiconductor element 3 provided with terminals (see Figures 1A to 1D ).
[0023] (2) A sealing step in which the semiconductor element is sealed under the condition that the terminal 3 a of the semiconductor element 3 and the terminal 5 a of the wiring circuit board 5 are opposed to each other via the sealing material 2 at an atmospheric pressure of 13300 Pa (absolute pressure) or less. 3 is pressed onto the wiring circuit board 5, thereby bonding the wiring circuit board 5 and the semicon...
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Abstract
The present invention provides a method of manufacturing a semiconductor device in which a semiconductor element is mounted on a wiring circuit board and a clearance between the wiring circuit board and the semiconductor element is sealed with a sealing material, the method including: a sealing material arranging step of arranging the sealing material on at least one of a terminal-provided surface of the semiconductor element and a terminal-provided surface of the wiring circuit board; a sealing step of pressing the semiconductor element to the wiring circuit board under such a condition that a terminal of the semiconductor element and a terminal of the wiring circuit board are opposed with each other via the sealing material at a reduced pressure of 13300 Pa (absolute pressure) or less, thereby combining the semiconductor element with the wiring circuit board; and subsequent to the sealing step, a terminal connecting step of heating and fusing at least one of the terminal of the semiconductor element and the terminal of the wiring circuit board at an atmospheric pressure, thereby connecting the terminal of the semiconductor element and the terminal of the wiring circuit board.
Description
technical field [0001] The present invention relates to a method of manufacturing a semiconductor device, which includes mounting a semiconductor element on a wiring circuit board. Background technique [0002] In recent years, semiconductor devices of reduced size, reduced thickness, and greater functionality have been developed. As they develop, size reduction, thickness reduction, and higher packing density of semiconductor elements therein are also required for semiconductor devices incorporated in semiconductor devices. In response to such demanded semiconductor devices, flip-chip type semiconductor devices have emerged. [0003] The flip chip type semiconductor device was manufactured in the following steps. That is, first, bumps (protruding terminals) are formed on one surface of the semiconductor element. Then, the bumps of the semiconductor element are aligned with the terminals formed on the wiring circuit board, and then the semiconductor element is mounted on ...
Claims
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IPC IPC(8): H01L21/60H01L21/56H01L21/58
CPCH01L2924/01015H01L2224/73203H01L2924/0105H01L2224/81203H01L2224/81801H01L24/13H01L2224/16H01L2224/27436H01L2224/13144H01L2924/01029H01L2224/13147H01L2224/75H01L2924/01027H01L21/563H01L2924/01087H01L2924/01013C09J163/00H01L2224/751H01L24/27H01L2224/75744H01L24/81H01L2924/01047H01L2224/73204H01L2924/01079H01L21/6836H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/10329H01L2924/01078H01L24/16H01L24/75H01L21/561H01L2224/13111H01L2224/27003H01L2924/15787C08L2666/02H01L2924/3512H01L2924/00
Inventor 野吕弘司清水祐作岛田克实塚原大祐
Owner NITTO DENKO CORP