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Welding structure and welding method

A welding method and structure technology, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuit parts, printed circuits assembled with electrical components, etc., can solve the problems of low reliability of welding structures and achieve high reliability , Improve product yield, reduce the effect of the possibility of short circuit or open circuit

Inactive Publication Date: 2011-04-20
INNOCOM TECH (SHENZHEN) CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0010] In order to solve the problem of low reliability of the welding structure in the prior art, it is necessary to provide a welding structure with high reliability

Method used

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  • Welding structure and welding method
  • Welding structure and welding method
  • Welding structure and welding method

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Embodiment Construction

[0031] see Figure 4 , is a schematic cross-sectional structure diagram of a preferred embodiment of the welding structure of the present invention. The soldering structure 200 includes a circuit substrate 210 , a soldering object 220 and a plurality of soldering bumps 230 . Wherein, the solder bump 230 is used to realize the electrical connection between the circuit substrate 210 and the soldering object 220 .

[0032] Please also refer to Figure 5 , is a schematic diagram of the three-dimensional structure of the circuit substrate 210 . The circuit substrate 210 is a printed circuit board, which includes a device area 218 and a soldering area 219 . The component area 218 is arranged in the middle area of ​​the circuit substrate 210, and it includes a plurality of electronic components (not shown) arranged on its surface, and the plurality of electronic components pass through the internal wiring of the circuit substrate 210 (not shown in the figure). ) are interconnecte...

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Abstract

The invention provides a welding structure which comprises a substrate, a welding object, a plurality of welding blocks and a supporting structure. The substrate comprises a plurality of first welding terminals. The welding object comprises a plurality of second welding terminals. Each welding block is correspondingly arranged between the first welding terminal and the second welding terminal. The welding object is electrically connected with the substrate through the welding blocks. The supporting structure is arranged on the surface of the substrate and partly covers the first welding terminals, the supporting structure supports the welding object to enable the welding object to keep a set distance with the substrate. The invention also provides a welding method at the same time.

Description

technical field [0001] The invention relates to a welding structure and a welding method. Background technique [0002] Generally, electronic components are directly mounted on a circuit substrate (such as a printed circuit board, etc.) to form an electronic circuit. The electronic circuit can realize signal transmission with other circuits through a flexible circuit board connected with the circuit substrate. In order to electrically connect the circuit substrate and the flexible circuit board to each other, most of the industry currently uses a thermocompression welding method to weld the flexible circuit board to the circuit substrate. [0003] The traditional thermocompression welding method is as follows: [0004] First, see figure 1 , providing a printed circuit board 110 . The printed circuit board 110 is used as a circuit substrate and includes a soldering area 119 . The soldering area 119 includes a plurality of soldering terminals 111 . [0005] Second, see ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K1/18H05K1/02
Inventor 黄柏山郑嘉雄
Owner INNOCOM TECH (SHENZHEN) CO LTD
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