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Latent curing agent

A latent curing agent and compound technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, printed circuit manufacturing, etc., can solve problems such as inability to adapt

Active Publication Date: 2009-11-18
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it cannot be adapted to the low-temperature curing epoxy resin composition in recent years.

Method used

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Examples

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preparation example Construction

[0043] According to the preparation method of the present invention described above, by changing the type and usage amount of silsesquioxane type oxetane derivative and alicyclic epoxy compound, the type and usage amount of aluminum chelating agent, reaction conditions, etc. , can control the curing characteristics of chelated aluminum latent curing agent. For example, if the reaction temperature is lowered, the curing temperature can be lowered, and conversely, if the reaction temperature is raised, the curing temperature can be raised.

[0044] The aluminum chelate latent curing agent of the present invention can be used for the same purposes as the conventional imidazole latent curing agent. Preferably, by using a silane coupling agent and a thermosetting compound in combination, a thermosetting combination with low-temperature rapid curing performance can be provided. thing.

[0045] In the thermosetting composition, if the content of the latent curing agent of the chelat...

Embodiment 1

[0060] In a three-necked flask made of Teflon (registered trademark) equipped with a condenser, 177.3 g of kerosene and an aluminum chelating agent (ethyl acetoacetate-aluminum diisopropoxide; ALCH, Kawaken FineChemicals Co., Ltd.) were added. 66% toluene solution 9.1g, the 66% toluene solution 9.4g of silsesquioxane type oxetane derivative (OX-SQ-H, Toya Synthesis Co., Ltd., Japan), and alicyclic epoxy compound (3, 4-epoxycyclohexanecarboxylic acid 3', 4'-epoxycyclohexyl methyl ester; CEL2021P, Daicel Chemical Industry Company) 66% toluene solution 4.2g, stirred with homogenizer (13500rpm) at 140°C for 30 minute. Then the 66% toluene solution 6.2g of bisphenol A type liquid epoxy resin (YL980, JapanEpoxy Resins Co., Ltd.) and 66% of 2-ethyl-4-methylimidazole (2E4MZ, Japan Shikoku Chemical Co., Ltd.) 0.6 g of the toluene solution was mixed and directly added dropwise to the reaction mixture, followed by further stirring at 140° C. with a homogenizer (13,500 rpm) for 30 minute...

Embodiment 2

[0062] The 66% toluene solution of bisphenol A liquid epoxy resin (YL980, Japan Epoxy Resins Co., Ltd.) is changed from 6.2g to 3.1g, and 2-ethyl-4-methylimidazole (2E4MZ, Japan Shikoku The 66% toluene solution of chemical into company) is changed into 0.3g by 0.6g, repeats the operation identical with embodiment 1 except that, obtains chelated aluminum class latent solidifying agent with yield 58%, and it is pale yellow powder.

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Abstract

An aluminum chelate-based latent curing agent, which can cure a thermosetting epoxy resin at a relatively low temperature in a short time, is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound, and then further reacting the resultant mixture with a liquid epoxy resin and an imidazole compound or with an aromatic vinyl compound and a radical polymerization initiator.

Description

technical field [0001] The present invention relates to an aluminum chelate latent curing agent capable of initiating curing of a thermosetting composition at a relatively low temperature, a preparation method thereof, and a latent curing agent containing the aluminum chelate latent curing agent and having good storage stability thermosetting composition. Background technique [0002] Thermosetting resin compositions such as epoxy resins are widely used as various adhesive materials, molding materials, etc., and latent imidazole-based curing agents are used as one of such curing agents. Since this latent imidazole curing agent does not show curing performance under normal storage conditions, it is widely used to make thermosetting epoxy resin compositions into one-component curing combinations with good handling properties and good storage stability. things. As a representative example of such a latent imidazole curing agent, a microcapsule-type latent imidazole curing age...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/70C08G65/22H01B1/22
CPCC08G59/70C08G59/24C08L63/00H05K3/323C08K5/5435C08K5/54C08K3/10
Inventor 小室胜彦伊东雅彦川岛糺增子大辅
Owner DEXERIALS CORP