Packing material and preparation method thereof

A technology of packaging materials and mixing materials, which is applied in transportation and packaging, chemical instruments and methods, thin material processing, etc., and can solve problems such as wear, poor cushioning capacity, and scratches on the product surface

Inactive Publication Date: 2009-11-25
JIANGSU YONGJIA ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing shipping pallets are made of polystyrene (PS) material through injection molding or blistering. The main disadvantages of pallets made of this material are that their surface damping coefficient is small and their cushioning capacity is poor. During the transportation process, the constant vibration and friction between the shipping pallet and the product often make the surface of the product scratched and worn

Method used

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  • Packing material and preparation method thereof
  • Packing material and preparation method thereof

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Embodiment Construction

[0017] see figure 1 and figure 2 According to the preferred embodiment of the present invention, the packaging material 10 includes a base layer 11 and a buffer layer 13 formed on a surface of the base layer 11 .

[0018] The base layer 11 is composed of polystyrene and additives, the mass ratio of the additives to polystyrene is 1:12-1:8, and the preferred mass ratio is 1:10. The additive is calcium carbonate.

[0019] The buffer layer 13 is made of silica gel. The silica gel is aminopropyl silica gel, such as aminopropyl silica gel of BS320929750G model. Generally, the thickness of the buffer layer 13 should be smaller than that of the base layer, so the mass ratio of silica gel to polystyrene can be 4:110~6:90, and the preferred mass ratio is 5:100.

[0020] The packaging material 10 can be subjected to blister processing.

[0021] The preparation method of above-mentioned packaging material 10 comprises the following steps:

[0022] Step S1: uniformly mix calcium ca...

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Abstract

The invention provides a packing material, which comprises a base layer and a buffer layer formed on a surface of the base layer; the base layer consists of polystyrene and additives; and the buffer layer is made of a silica gel material. The packing material has good buffer and damping function. The invention also provides a preparation method for the packing material and a packing product made of the packing material.

Description

technical field [0001] The invention relates to a packaging material, in particular to a shock-absorbing and cushioning blister packaging material and a preparation method thereof. Background technique [0002] Today, when material products are extremely abundant, people have increasingly strict requirements on product performance and appearance quality, and whether the design of product packaging structure and the use of materials are scientific and reasonable have become an important factor affecting product appearance quality. Because most products are inseparable from packaging from production to sales and even being used by consumers, if the design of packaging structure and the use of materials are unreasonable, it is easy to cause damage and dirt to the appearance and quality of the packaged products. [0003] For example, in the circulation process of products, for the convenience of transportation, products are usually packaged in batches on shipping pallets. Most ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/03B29C70/68B29C73/00B29K23/00B29K83/00
CPCB32B9/04B32B27/20B32B27/14B32B27/18B32B27/302B32B2264/102B32B2307/50B32B2553/02Y10T428/24996Y10T428/249958
Inventor 张少辉邓剑斌赵一余江刘波袁清明
Owner JIANGSU YONGJIA ELECTRONICS MATERIALS
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