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Light source device

A technology of a light source device and a package body, which is applied in the direction of light source, point light source, lighting device, etc., can solve the problems of reducing the luminous efficiency of the light-emitting element 123 and the heat cannot be removed, and achieves lowering temperature, reducing thermal resistance, and improving heat dissipation efficiency. Effect

Inactive Publication Date: 2011-09-28
ZHANJING TECH SHENZHEN +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat generated by the plurality of light emitting elements 123 cannot be removed from the casing 11 in a timely and effective manner, thereby reducing the luminous efficiency of the plurality of light emitting elements 123

Method used

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Embodiment Construction

[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] See figure 2 A light source device 20 provided by the first embodiment of the present invention includes an insulator 21 , a heat conductor 22 , a metal conductive layer 23 , a plurality of LED chips 24 , metal wires 25 , and a transparent package 26 .

[0018] The insulator 21 has a first surface 211 and a second surface 212 opposite to the first surface 211 of the insulator 21, and a plurality of first through holes 2101 are formed on the second surface 212. The material used for the insulator 21 can be plastic , such as polyparaphenylene terephthalamide (Polyphthalamide, PPA), liquid crystal polymer (Liquidcrystal polymer, LCP) and the like.

[0019] The heat conductor 22 is a cuboid structure, which has an upper surface 221 , a lower surface 222 opposite to the upper surface 221 , and a side surface 223 disposed between the upper surface 221 and ...

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Abstract

The invention relates to a light source device with light emitting diode chips, which comprises an insulator, a heat conductor, a metal conductive layer, a plurality of light emitting diode chips, a metal wire and a transparent encapsulating body, wherein the insulator is provided with a first surface, a second surface and a plurality of first through holes; the heat conductor is closely jointed with the first surface of the insulator, and the heat conductor is provided with a part exposed on the first through holes of the insulator; the metal conductive layer is arranged on the second surfaceof the insulator, and is provided with second through holes which run through the first through holes; the light emitting diode chips are arranged on the part of the heat conductor exposed on the first through holes of the insulator so as to be connected with the heat conductor; the light emitting diode chips are electrically connected with the metal conductive layer through the metal wire respectively; and the transparent encapsulating body is arranged on the second surface of the insulator so as to cover the light emitting diode chips and the metal wire.

Description

technical field [0001] The invention relates to a light source device, in particular to a light source device with solid-state light-emitting elements such as light-emitting diode chips. Background technique [0002] Now, light emitting diodes (Light Emitting Diode, LED) have been widely used in many fields. Here, a new type of light emitting diode can be found in the document IEEE Journal on Selected Topics in Quantum Electronics, Vol.8, No. .2, Illumination With Solid State Lighting Technology in March / April 2002. LEDs can generally emit light of specific wavelengths, such as visible light, but most of the energy received by LEDs is converted into heat, and the rest of the energy is actually converted into light energy. Therefore, the heat generated by the light-emitting diodes must be dissipated to ensure the normal operation of the light-emitting diodes. [0003] Such as figure 1 As shown, a light source device 10 includes a housing 11 , a light source module 12 and a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L23/34F21V19/00F21V15/02F21Y101/02F21V29/00F21V29/508F21V29/71F21V29/89F21Y115/10
CPCH01L2224/48091H01L2924/01322H01L2924/00014H01L2924/00
Inventor 张忠民徐智鹏王君伟
Owner ZHANJING TECH SHENZHEN