Device for holding plate-like article

Abstract

The invention relates to a device for holding a plate-like article, comprising: a rotating axle and a chuck body rotating on the rotating axle for holding the plate-like article, the chuck body comprises at least three spoke-shaped supports or circular trays in the radial distribution, a chock block of the chuck body is arranged under, a spring is mounted on the chock block of the chuck body, at least three holding elements are arranged at the edge of the chuck body and are used for clamping the plate-like article, a chock block of the holding element is arranged at the bottom of the holding element and can be inserted into the spring and extrude the spring until contacting the chuck body chock block of the chuck body, a drive member is arranged at the position under the chuck body relative to the each holding element and is used for push or suck the holding element to rotate, consequently, the plate-like article is loosened and clamped. The device of the invention has simple structure, easy realization, and little damage to the plate-like article.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer technology, in particular to a device for clamping a disc. Background technique [0002] The most widely used wafer chucks in the field are pin chucks, Bernoulli suction cups, etc. In the U.S. patent that application number is US5513668 and US4903717, disclose a kind of chuck that utilizes Bernoulli's principle that wafer is fixed, utilize Bernoulli's principle to form one deck air cushion between chuck and wafer, utilize air cushion to keep wafer, Radial positioning is achieved by clamping elements distributed around the wafer circumference. This structure well reduces the contact between the wafer and the chuck, thereby reducing damage to the wafer. However, the structure is relatively complicated and not easy to realize, and because the gas passes through the middle of the shaft, it is easy to bring the particles generated in the pipeline to the surface of the wafer. In the paten...

AI Technical Summary

Problems solved by technology

But the structure is more complicated, it is not easy to realize, and because the gas passes through the middle of the shaft, it is easy to bring the particles generated in the pipeline to the surface of the wafer

In the patent US6167893, a wafer is clamped by utilizing the centrifugal force acting on the clamping element. This structure is relatively simple, but the clamping element is easy to generate a bending moment on the wafer, which is easy to cause damage to the wafer, and the clamping The contact area between the holding element and the wafer is relatively large, which can easily cause uneven distribution of the cleaning solution, thus affecting the cleaning effect

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