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Miniature surface-adhered type fuse

A surface mount and fuse technology, applied in emergency protection devices, electrical components, circuits, etc., can solve the problems of high cost and complicated procedures, and achieve the effect of simplifying the production process and improving the fusing performance

Active Publication Date: 2009-12-02
NANJING SART SCI & TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process is complex and costly

Method used

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  • Miniature surface-adhered type fuse
  • Miniature surface-adhered type fuse
  • Miniature surface-adhered type fuse

Examples

Experimental program
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Effect test

Embodiment 1

[0016] Such as figure 2 ,

[0017] refer to figure 1 , figure 2 , the manufacturing method of the patent of the present invention comprises the following steps

[0018] Step 1: Provide an insulating substrate 1 made of Al 2 o 3 .

[0019] Step 2: screen-print a layer of thicker metal paste on the electrodes at both ends of the substrate 1, and the material is silver, copper or gold.

[0020] Step 3: According to the shape of the chip fuse melt, a layer of metal paste is printed on the substrate 1 by a screen printing method, and the material is silver, copper or gold. After high-temperature sintering, the melt metal film 2 and the electrode metal film 7 are formed, and the thickness of the melt metal film 2 is thinner than the electrode metal film 7; the sintering temperature is determined according to the composition of the slurry. The melt can be of any geometric shape.

[0021] Step 4: Coat the electrode part with a plating resist coating, and form a specific patt...

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PUM

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Abstract

The invention relates to a miniature surface-adhered type fuse comprising an insulation base plate, an electrode part, a metal fusant part and a protection layer covered on the base plate and the fusant among the electrodes. The miniature surface-adhered type fuse is characterized in that the fusant is formed by a metal film, a first metal layer and a second metal layer together, and the three metal layers are respectively formed by a silk-screen printing method and an electroplating method. Because the final shape of the fusant of the fuse is determined before the fusant of the fuse is formed, re-shaping is not needed before one metal layer is formed every time, and the production technology is simplified.

Description

technical field [0001] The patent of the present invention relates to a chip fuse for protecting electronic components, in particular to a miniature surface-mounted fuse. technical background [0002] Chip fuses (surface mount fuses) are mainly used for overload protection of printed circuit boards and other circuits to protect the safe operation of electronic components. The body itself fuses and cuts off the current to protect the circuit. [0003] In the production process of the well-known chip fuse, a heat-insulating layer is first formed on an insulating substrate, and a multi-layer metal film is deposited on it, and then the metal film corresponding to the position of the melt is etched and shaped for several times respectively. Form the first metal layer, diffuse the buffer layer and the second metal layer to form the melt part of the fuse, and finally cover the multi-layer protective layer, and then form the back electrode and the terminal electrode. The process i...

Claims

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Application Information

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IPC IPC(8): H01H85/046H01H69/02
Inventor 南式荣曹小明
Owner NANJING SART SCI & TECH DEV
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