Method for manufacturing outer graphics of electronic circuit board by encapsulation method

A technology for electronic circuit boards and outer graphics, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of long process cycle, large one-time investment, and low efficiency, so as to reduce operation links and time, reduce The effect of quality defects

Inactive Publication Date: 2009-12-02
JIANGSU SUHANG ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The one-time investment of this process is large, the process cycle is long, and the efficiency is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0007] Embodiment: a kind of method for making the outer layer pattern of electronic circuit board by masking method, carry out according to the following steps: ①. Whole board electroplating: one-time plated to required thickness; ②. Outer layer dry film pre-treatment; ③. Paste Outer layer dry film; ④. Film alignment and exposure: The film is drawn according to the graphic design, and the alignment is placed on the dry film according to the design requirements. The part of the film corresponding to the graphics on the circuit board is transparent, and the part of the unnecessary graphics is opaque. The dry film under the light-transmitting part of the film reacts after exposure; ⑤. Outer layer development: retain the exposed dry film, and develop the unexposed dry film; ⑥. Outer layer etching: use acid etching solution Exposed metal etching; ⑦. Outer film withdrawal: remove the dry film on the graphics; ⑧. Inspection board.

[0008] Use dry film instead of electroplated tin l...

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PUM

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Abstract

The invention discloses a method for manufacturing outer graphics of an electronic circuit board by an encapsulation method, comprising the following steps: 1. electro-plating an entire panel: the entire panel is electro-plated to the desired thickness for one time; 2. pretreating a dry film on the outer layer (namely, cleaning); a. sticking the dry film on the outer layer; 4. registering and exposing the film: the film is drawn according to the graphics design and is arranged on the dry film by registration according to the requirement of the design, the desired graphic parts on the corresponding circuit board of the films are non-lighttight, and the undesired graphic parts are lighttight, the dry film under the non-lighttight parts of the film can react after being exposed; 5. developing the outer layer: the dry films which are exposed are retained, and the dry films which are not exposed are developed away; 6. etching the outer layer: acid itching liquid is used for itching the exposed metal on the board; 7. removing the film on the outer layer: the dry films on the graphics are removed; 8. inspecting the panel. The invention reduces the operational links, and further reduces the quality defects appearing in the operational links, reduces the use of devices and decreases the production cost.

Description

technical field [0001] The invention relates to a method for making an outer layer pattern of an electronic circuit board by a masking method. Background technique [0002] The current traditional outer layer graphics production technology uses electroplating tin as the semi-additive process of the anti-corrosion protective layer. The process follows the following steps: ①. Whole board electroplating: plated to the set thickness; ②. Outer layer dry film pretreatment (that is, clean it); ③. Paste the outer layer of dry film; ④. Film alignment and exposure: the film is drawn according to the graphic design, and the position is aligned on the dry film according to the design requirements. The film corresponds to the part of the graphics that is not needed on the circuit board. , the part of the graphic that needs to be opaque, and the dry film under the transparent part of the film reacts after exposure; ⑤. Outer layer development: keep the dry film on the unnecessary graphic, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02
Inventor 杨雪林
Owner JIANGSU SUHANG ELECTRONIC CO LTD
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