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Method for three-dimensionally capturing and rotating micromechanical member by using ultrasonic radiation force

A technology of micro-mechanical components and ultrasonic radiation, applied in the direction of micro-structure technology, micro-structure devices, chemical instruments and methods, etc., can solve problems such as inability to release it, damage to micro-components, inability to drive objects to rotate, etc.

Inactive Publication Date: 2011-09-07
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage of the micro-component manipulation technology based on micro-clamps is that on the one hand, it is difficult to achieve feedback control of the clamping force and cause damage to the micro-components; Attachment will exceed the gravity of the micro-component itself, making it impossible to release it
However, the current micro-component manipulation technology based on ultrasonic radiation force can only meet the two manipulation requirements of clamping and translation, and has not yet solved the problem of micro-component rotation manipulation. method, but its controllable objects are limited to sound-absorbing materials, and more importantly, this method cannot solve the general situation of driving objects to rotate while capturing

Method used

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  • Method for three-dimensionally capturing and rotating micromechanical member by using ultrasonic radiation force
  • Method for three-dimensionally capturing and rotating micromechanical member by using ultrasonic radiation force
  • Method for three-dimensionally capturing and rotating micromechanical member by using ultrasonic radiation force

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with drawings and embodiments.

[0017] Such as figure 1 As shown, the present invention uses four identical plane quarter-circle fan-shaped ultrasonic transducers to form a complete circle, and controls the initial phases of the driving signals of the four transducers so that they are sequentially different by 90°. At this time, the four ultrasonic transducers The synthetic sound field of the transducer has a helical wavefront, and another planar circular ultrasonic transducer is arranged on the axis passing through the center of the circle and perpendicular to the plane where the circular surface is located, and its radiated sound wave propagation direction is the same as that of the four transducers mentioned above. The propagation direction is opposite, and the micro-components located in the interference superposition sound field of the four parallel transducers and the backpropagation transducer ...

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Abstract

The invention discloses a method for three-dimensionally capturing and rotating a micromechanical member by using an ultrasonic radiation force. In the method, four ultrasonic transducers are used to generate a wave beam having a spiral wave front, the wave beam interferes and is superposed with a radiation wave beam generated by an ultrasonic transducer which is coaxial with and opposite to the four ultrasonic transducers, an interferential sound field has the capacity for three-dimensionally capturing the micromechanical member, and the direction angle of an ultrasonic radiation force potential trough along the circumferential direction of an ultrasonic transducer phase is adjusted and changed to drive the micromechanical member to rotate around an axis. Compared with the conventional operation policy, the method has an important function of angle control and can control the rotation direction and angle of the micromechanical member. The method plays a significant role on occasions when non-contact operation of the micromechanical member is required and can be used in high-tech fields of micro electro mechanical system manufacture and assembly, biomedical engineering and the like.

Description

technical field [0001] The invention relates to a method for capturing and rotating a micromechanical component in three dimensions by using ultrasonic radiation force. Background technique [0002] At present, for the manipulation of micro-scale mechanical components in MEMS technology (generally referring to micro-mechanical components with a size of 1 micron to 100 microns), micro-clamps are generally used to perform clamping, translation, rotation, release and other manipulations under the observation of a microscope. . The disadvantage of the micro-component manipulation technology based on micro-clamps is that on the one hand, it is difficult to achieve feedback control of the clamping force and cause damage to the micro-components; Attachment will exceed the gravity of the micro-component itself, making it impossible to release it. In order to solve the shortcomings of contact micro-manipulation, some specialized technical means have been developed to realize the ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C5/00B81C99/00
Inventor 范宗尉杨克己梅德庆陈子辰
Owner ZHEJIANG UNIV
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