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Vacuum chamber for processing substrate and apparatus including the same

A technology of vacuum chamber and substrate, applied in the field of vacuum chamber, can solve the problems of low strength and shortened service life of the bearing chamber 12, and achieve the effect of preventing deformation

Active Publication Date: 2009-12-30
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the loading chamber 12 is formed of a relatively low-strength metal material such as aluminum (Al), the chamber body 28 and the chamber cover 29 of the loading chamber 12 may be subjected to repeated pumping at a relatively high temperature. and ventilation and deformation, resulting in shortened service life of the bearing chamber 12

Method used

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  • Vacuum chamber for processing substrate and apparatus including the same
  • Vacuum chamber for processing substrate and apparatus including the same
  • Vacuum chamber for processing substrate and apparatus including the same

Examples

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Embodiment Construction

[0105] Reference will now be made in detail to the embodiments illustrated in the accompanying drawings. Wherever possible, like reference symbols will be used to refer to the same or like parts.

[0106] image 3 It is a diagram showing a cluster device according to an embodiment of the present invention.

[0107] exist image 3 In the example, the cluster tool 110 includes a substrate loader / unloader 118 , a load chamber 112 , a transfer chamber 114 and a number of processing chambers 116 . The number of substrates 120 is input into the substrate loader / unloader 118 for processing, and the number of substrates 120 is output from the substrate loader / unloader 118 after processing is complete. The load chamber 112 is disposed between the substrate loader / unloader 118 and the transfer chamber 114 , and thus, the plurality of substrates 120 are transported from the substrate loader / unloader 118 to the transfer chamber 114 via the load chamber 112 . The substrate loader / unloa...

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PUM

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Abstract

A vacuum chamber for processing a substrate includes: a chamber body; and a chamber lid combined with the chamber body, wherein the chamber lid comprises: a frame having a plurality of openings; and a plurality of plates combined with the plurality of openings, each of the plurality of plates having a higher heat conductivity than the frame. The vacuum chamber provided by the invention can prevent deformation caused by increased intensity.

Description

【Technical field】 [0001] The present invention relates to a vacuum chamber for processing substrates, in particular to a vacuum chamber with a chamber cover and equipment comprising the vacuum chamber. 【Background technique】 [0002] Generally, processing of semiconductor devices, such as flat panel display devices and solar cells, involves repeating the following steps: depositing thin films; photolithography steps to pattern photoresist (PR) layers; and etching the patterned thin films. The deposition step and the etching step can be performed in a chamber of a device having a reaction space separated from the outside, for example, a cluster type device including a load-lock chamber, a transfer chamber, and a processing chamber can be used. For the deposition step and the etching step, the transfer chamber and the processing chamber may have a vacuum state during the deposition step and the etching step. In particular, since the substrate is input into the carrying chambe...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/20H01L21/3065H01L21/31H01L21/311
CPCH01L21/67201H01L21/67109Y10T137/86083H01L21/00H01L21/02
Inventor 崔贤范车安基
Owner JUSUNG ENG