Electronic device comprising differential sensor mems devices and drilled substrates

Abstract

Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises: - a substrate (2) provided with at least one passing opening (5), - a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at lesat one portion (11) sensitive to chemical and / or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11 a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises - a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).

Description

technical field [0001] The invention relates to an electronic device comprising a MEMS device and a drilled substrate, in particular of the LGA or BGA type. [0002] The present invention relates particularly, but not exclusively, to electronic devices comprising MEMS differential sensors mounted on LGA substrates, wherein the MEMS differential sensors require a dual physical interface to communicate with the environment external to the electronic device, and by way of illustration only The method is described below with reference to the field of this application. Background technique [0003] As we all know, a MEMS device (Micro-Electro-Mechanical System) is a micro-device that integrates mechanical and electrical functions on a silicon chip or die by using photolithography for microfabrication. [0004] In particular, refer to figure 1 , describes a MEMS differential pressure sensor 100 comprising a silicon die 101 formed from an annular portion 102 and a circular or squ...

AI Technical Summary

Problems solved by technology

[0014] Although these embodiments of assembled electronics including a MEMS differential pressure sensor are advantageous in several respects, they still have the disadvantage of being bulky because the cavity 106 must be wide enough to accommodate the die 101 and allow for wire bonding alternative join operation

[0019] Since these process steps are not provided in conventional process flows for implementing integrated circuits, this results in a considerable increase in final device cost

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