Cutting device
A cutting device and component technology, applied in the direction of fine working devices, working accessories, stone processing equipment, etc., can solve the problem of device quality degradation and achieve the effect of preventing quality degradation
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[0021] figure 1 The cutting device 1 shown is a device for cutting a wafer held on a chuck table 2 by a cutting member 3 . At the front of the cutting apparatus 1, there is a cassette loading area 4 where a wafer cassette 4a for storing wafers to be cut is placed. Further, a loading / unloading member 5 for loading and unloading wafers from and into the wafer cassette 4 a is disposed on the rear side of the cassette loading area 4 .
[0022] A temporary storage area 5 a is provided between the cassette loading area 4 and the loading / unloading member 5 as an area where wafers are temporarily loaded. In addition, a first transfer member 6 a for transferring a wafer between the temporary storage area 5 a and the chuck table 2 is disposed near the temporary storage area 5 a.
[0023] The chuck table 2 is movable in the X-axis direction, and an alignment member 7 for imaging the wafer held on the chuck table 2 to detect a region to be cut is disposed above the movement path of the ...
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