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Method for testing bond strength of materials

A technology of bonding strength and testing method, which can be used in analyzing materials, measuring devices, instruments, etc., and can solve problems such as difficulty in grasping

Inactive Publication Date: 2010-02-17
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the actual measurement, the position of the measurement point E that can make the angle between the hook and the leads on both sides equal is difficult to grasp, because it is no longer the midpoint of the horizontal position of the two bonding points

Method used

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  • Method for testing bond strength of materials
  • Method for testing bond strength of materials
  • Method for testing bond strength of materials

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0023] Embodiment 1: see image 3 , the present invention adopts the method of single bonding point wire bonding tension test, that is, the bonding test lead 2 perpendicular to the surface where the bonding point 1 is located is fastened on the clamping fixture 3, and the lower end of the clamping fixture 3 is provided with a Groove 4, the bonding test lead 2 is pasted in the groove 4 of the clamping fixture 3 by glue, and the clamping fixture 3 is pulled by the stress sensor or tension meter 5 on the bonding point 1 at a rate of no more than 2g per second Pull up vertically at a constant rate to directly read the tension value on the tension meter to obtain the bonding strength of the bonding point, and obtain the bonding strength of another bonding point in the same way. Let the tensile force displayed by the tension meter be F 1 , and assume that the tensile strength of the bonding test lead and bonding point is the same everywhere as F 2 , and once the force on the lead ...

Embodiment 2

[0024] Example 2, see Figure 4 In this embodiment, there is a small hole in the clamping fixture 3, and the bonding test lead 2 is tightened and fixed by the rubber nut after passing through the small hole. The test method is the same as that of the first embodiment.

Embodiment 3

[0025] Embodiment 3: see Figure 5 , the present embodiment utilizes frictional force, and the clamping fixture 3 adopts two aluminum plates with rubber, and the bonding test lead 2 is clamped by two aluminum plates with rubber, and then the two aluminum plates with rubber are fixed, and the test method is the same as the implementation example 1.

[0026] The present invention starts from the tensile force of accurate measurement of bonding strength. For the destructive wire bonding tensile test of double bonding points, the ideal situation is that the hook and the leads on both sides are all at 120 degrees. The force received is the same, so the value read by the spring is the accurate bond strength value. In actual operation, it is necessary to visually check the position of the hook by the operator so that the angle between the spring and the two leads is 120°, that is, it is difficult to obtain accurate bonding strength. The test method of the wire bonding tensile test ...

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Abstract

The invention discloses a method for testing bond strength of materials. The generally adopted method for measuring the bond strength is mainly a tensile test method of destructive wire bonding of double bonding points. Operating error can not be easily avoided in the actual operation, so that accurate bond strength can not be obtained. The method of the invention is different from the existing tensile test method of destructive wire bonding of double bonding points in which a lifting hook is hung in the middle of the wire. By adopting the tensile test method of destructive wire bond of a single bond point, a bonding point one and a bonding point two are measured individually, so that tension numerical value can be directly read on a tensometer. The accurate bond strength can be obtained.

Description

technical field [0001] The invention relates to a test method, in particular to a test method for material bonding strength. Background technique [0002] Wire bonding is a widely used soldering technique. Wire bonding is simple in process, low in cost, applicable to various packaging forms and plays a leading role in connection methods. At present, 90% of all package pins are wire bonded. The quality of wire bonding directly affects the performance of components and the yield of packaging. Therefore, it is necessary to objectively and accurately measure the bonding strength. [0003] For the destructive wire pull test of the double bonding point where the two bonding points are on the same level: put a semicircular metal hook on the wire between the two soldering points, and then use a constant rate of no more than 2 grams per second to vertically pull. figure 1 It is the wire pull test situation where the two bonding points are in the same horizontal plane. Assuming ...

Claims

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Application Information

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IPC IPC(8): G01N19/00
Inventor 张方辉席俭飞陆君福姚毅
Owner SHAANXI UNIV OF SCI & TECH
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