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Portable electronic device and manufacturing method and scent supplementing method thereof

A technology of electronic devices and manufacturing methods, applied in the direction of electrical components, circuits, vaporized substances, etc., which can solve the problems of inability to effectively use the heat energy of chipsets

Inactive Publication Date: 2012-03-21
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in traditional portable electronic devices, the cooling device can only dissipate the heat energy generated by the chipset, and cannot effectively utilize the heat energy generated by the chipset

Method used

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  • Portable electronic device and manufacturing method and scent supplementing method thereof
  • Portable electronic device and manufacturing method and scent supplementing method thereof
  • Portable electronic device and manufacturing method and scent supplementing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] In the portable electronic device of the present invention, odor-emitting substances are formed on the heat dissipation element. When the electronic components generate high temperature during operation, the odor-emitting substances on the heat dissipation element can be volatilized by the high temperature, thereby making the portable electronic device Has a smell.

[0019] figure 1 According to an embodiment of the present invention, the perspective view of the back side of the portable electronic device is provided with a circuit board 30 in a housing 10 of the portable electronic device. The circuit board 30 has a first electronic component 50, a first heat dissipation component 52 is disposed on the first electronic component 50 . In addition, the first cover plate 40 can also be arranged on the first heat dissipation element 52 to cover the first heat dissipation element 52 and the first electronic component 50, wherein the first cover plate 40 does not completely...

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Abstract

The invention discloses a portable electronic device and a manufacturing method and a scent supplementing method thereof. The portable electronic device comprises a circuit board which is provided with an electronic component and is arranged in a shell, and a radiating element which is provided with a material capable of emitting scent and is arranged on the electronic component, wherein the electronic component has a temperature when operated; and the material capable of emitting the scent is volatilized at the temperature of the operation of the electronic component. Moreover, the manufacturing method for the portable electronic device comprises the following steps: forming the material capable of emitting the scent on the radiating element; and arranging the radiating element on the electronic component of the circuit board. The scent supplementing method for the portable electronic deice comprises the step of injecting the liquid material capable of emitting the scent into a hole of a cover board on the radiating element so as to form the material capable of emitting the scent on the radiating element.

Description

technical field [0001] The invention relates to a portable electronic device, in particular to a portable electronic device emitting a smell. Background technique [0002] Generally speaking, a portable electronic device such as a mobile phone has a printed circuit board, and the printed circuit board usually has a variety of chipsets. When the portable electronic device is in normal operation, the chipset on the printed circuit board will High heat is generated, which is useless and harmful to the chipset or other electronic components in the portable electronic device. Therefore, it is necessary to dissipate the heat generated by the chipset through the heat sink. [0003] In traditional portable electronic devices, the heat dissipation device uses materials with high thermal conductivity, such as metal materials, to transfer heat generated by the chipset to the air, so as to reduce the temperature of the chipset. However, in conventional portable electronic devices, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20A61L9/03H01L23/34
Inventor 吴忠伦刘玉章曾崇诚
Owner HTC CORP