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Preparation method of inorganic powder cataplasm

A powder paste, inorganic powder technology, applied in mixing methods, chemical instruments and methods, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as inability to obtain dispersion effect, large shear force, and difficulty in obtaining , to achieve the effect of excellent dispersibility, good dispersibility and excellent dispersibility

Active Publication Date: 2013-01-09
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the inventors have found a new problem that a desired dispersion effect cannot be obtained even if a shearing force is applied as described above in a state containing inorganic powder.
The problem is that if inorganic powder is present, in order to obtain the same state as in the case of not containing inorganic powder, a very large shearing force must be applied, and it is basically difficult to obtain such a large shearing force with existing equipment

Method used

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  • Preparation method of inorganic powder cataplasm
  • Preparation method of inorganic powder cataplasm
  • Preparation method of inorganic powder cataplasm

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Embodiment Construction

[0033] best practice

[0034] figure 1 It is a process drawing which shows the manufacturing method of the inorganic powder paste of 1st Embodiment of this invention. The inorganic powder paste to be obtained contains an inorganic powder component and an organic compound capable of improving the dispersibility of the inorganic powder component by being adsorbed on the inorganic powder component in a solvent.

[0035] To prepare the inorganic powder component, a step of obtaining a first mixture 1 containing at least an inorganic powder component and a step of obtaining a second mixture 2 containing at least a solvent and an organic compound but not containing an inorganic powder component can be performed.

[0036] Then, a shearing action application step 3 of applying a shearing force to the second mixture 2 is performed, and then a mixing step 4 of mixing the first mixture 1 and the second mixture 2 is performed to obtain an inorganic powder paste 5 . In order to obtain th...

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Abstract

When preparing an inorganic powder cataplasm wherein the solvent contains inorganic powder component and can imprve the dispersibility of the inorganic powder component by organic compound adsorbed on the inorganic powder component, if the inorganic powder component is micronized, the organic compound cannot sufficiently adhered to the surface of the inorganic powder component, and the dispersibility of the inorganic powder cataplasm is reduced. The method includes: obtaining a first mixture 1 at least containing inorganic component and a second mixture 2 at least containing solvent and organic compound but not containing inorganic powder; applying shearing force to the second mixture 2; and then mixing the first mixture 1 and the second mixture 2.

Description

technical field [0001] The present invention relates to a method for producing an inorganic powder paste, and more particularly, to a method for producing an inorganic powder paste that can be used as a method for producing a conductive paste for forming internal conductors in laminated ceramic electronic components. Background technique [0002] When dispersing fine inorganic powder in a solvent to obtain an inorganic powder paste, it is important to uniformly disperse the inorganic powder in the paste. As a method for uniformly dispersing the inorganic powder in the paste, for example, there is a method of adsorbing an organic compound as a dispersant for improving the dispersion stability of the inorganic powder in the inorganic powder. In this method, how to attach the organic compound to the inorganic powder in the best state is the key point. [0003] Inorganic powder pastes generally have high viscosity, so it is difficult to disperse the inorganic powder uniformly. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01F3/14H01B1/22H01B13/00C09D5/24C09D201/00B01F23/57B01F25/70
CPCH01B1/16
Inventor 大森贵史绪方直明
Owner MURATA MFG CO LTD
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