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Chemical-copper plating liquid and copper plating production process

A copper plating solution and chemical technology, which is applied in the field of copper plating production process and chemical-electroplating copper solution, can solve the problems of poor solution stability, high production cost, and difficult separation of metal ions, etc., and achieve strong bonding force and impurity resistance of the plating layer Strong, effective control of harmful impurities

Active Publication Date: 2011-04-20
河北聚贤环保科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For more than 160 years of electroplating history, cyanide copper plating has been widely used in copper plating, and electroless copper plating is copper plating with formaldehyde as a reducing agent. The common defects of the two are: first, the application fields and functions are not compatible with each other
Electroless copper plating has no application value on copper plating on metal workpieces
The second is that they are all toxic and harmful substances, which are very harmful to the human body and the environment.
The third is that the deposition speed is slow, especially the deposition speed of electroless copper plating is only 0.17 μm / hour. Except for copper plating on circuit boards, copper plating in other fields has no use value
Its disadvantages are: they are all used for copper plating on circuit boards, and have no use value on steel and other non-metallic materials; second, the copper ion content is low 2 to 30 g / L, and the deposition speed is slow; third, copper plating is strong at high temperatures. In alkali, copper ions are quickly oxidized by copper hydroxide, copper oxide and monovalent copper, the solution has poor stability and difficult maintenance operations; the fourth is that the service life is short, it will be scrapped quickly, and the production cost is high; most solutions generally contain strong Complexing agent EDTA, it is difficult to treat sewage after plating, metal ions are not easy to separate, and it is easy to cause new environmental pollution
[0006] In summary, it can be seen from the patented technology of cyanide-free copper plating and formaldehyde-free copper plating at home and abroad that they are used for copper plating on iron and steel metals. The process is immature and unstable, and cannot be industrialized, and they cannot replace cyanide copper plating.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] According to the loading capacity is 1dm 2 / kg to calculate the tubular iron and steel workpieces that need to be copper-plated, then grind, polish, degrease and derust the tubular iron and steel copper-plated workpieces, wash them with water, and then electrolytically degrease and wash them to complete the pretreatment of the tubular steel copper-plated workpieces, and take copper sulfate 50kg, 40kg of sulfuric acid, 20kg of potassium sodium tartrate, 5kg of sodium hypophosphite, 3kg of nickel chloride, and 882kg of deionized water are used to make chemical-electroplating copper solution 1000kg, add it to the plating tank, and put the pretreated tubular steel copper-plated workpiece into the plating tank. Chemical-electroplating copper in the tank, the conditions are: the anode is a phosphorus-containing copper plate of 3‰, the area ratio of the anode and the cathode is 2:1, and the cathode current density is 0.5A / dm 2 , the temperature of the copper plating solution i...

Embodiment 2

[0048] The pretreatment of tubular iron and steel copper-plated workpieces is the same as in Example 1, and the loading capacity is 2.0dm 2 / kg, take copper sulfate 10kg, hydrochloric acid 5kg, nitrilotri-20kg and hydrazine sulfate 3kg, make chemical-electroplating copper solution 1000kg with deionized water 962kg and add in the plating tank, put the tubular steel copper-plated workpiece after pretreatment into the plating Chemical-electroplating copper in the tank, the conditions are: the anode is a phosphorus-containing copper plate of 3‰, the area ratio of the anode and the cathode is 2:1, and the cathode current density is 1A / dm 2 , use sulfuric acid to adjust the PH value to 1.0, the temperature of the copper plating solution is room temperature, the copper plating time is 8 minutes, the deposition rate of the coating is 0.5um / min, the cathode moves, the air is stirred, and the circulation is filtered. The chemical-electroplated copper of the workpiece is completed, and th...

Embodiment 3

[0051] The steel tubular copper-plated workpiece pretreatment is the same as embodiment 1, and the loading capacity is 3.0dm 2 / kg, take 150kg of copper sulfate, 20kg of phosphoric acid, 15kg of sodium citrate and 100kg of glucose and make it with 715kg of deionized water. After adding 1000kg of chemical-electroplating solution into the plating tank, put the pretreated tubular steel copper-plated workpiece into the plating tank for Chemical-electroplating copper, the conditions are: the anode is 3‰ phosphorus-containing copper plate, the area ratio of anode and cathode is 2:1, and the cathode current density is 1.5A / dm 2 , use sulfuric acid to adjust the PH value to 1.5, the temperature of the copper plating solution is room temperature, the copper plating time is 9 minutes, the deposition rate of the coating is 0.4um / min, the cathode moves, the air is stirred, and the circulation is filtered, and the chemical-electroplated copper of the workpiece is completed, and the obtained...

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PUM

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Abstract

The invention relates to chemical-copper plating liquid and a copper plating production process, which are used for copper plating of tubular steel and iron pieces and non-metal pieces, and are characterized in that: the chemical-copper plating liquid consisting of copper sulphate, a retarder, a complexant, a reductant and deionized water is used to pretreat a workpiece and then the workpiece is subjected to chemical-copper plating; an anode is 0.3 percent phosphor-containing copper plate; the area ratio of the anode and the cathode is 2:1; the current intensity in the cathode is 0.5 to 4A / dm<2>; the pH value of the copper plating liquid is 1.0 to 3.0; the temperature of the copper plating liquid is normal temperature; and the carrying capacity is 1 to 4dm<2> / kg; the copper plating time is 8 to 10 minutes. The liquid and the process have the advantages of firm bonding between cladding and a substrate, stable process, high impurity resistance, long service life, crystalline simple copper cladding, fine cladding crystallization, low porosity, high anticorrosion performance, simple operation, convenient maintenance, no formaldehyde, no damages to human bodies and environment, and environmentally-friendly product.

Description

technical field [0001] The invention relates to a chemical-electroplating copper solution, which is suitable for copper-plating iron and steel tubular workpieces and non-metal parts, and belongs to the field of copper-plating solutions. [0002] The invention also relates to a copper plating production process using the electroless copper plating solution. technical background: [0003] For more than 160 years of electroplating history, cyanide copper plating has been widely used in copper plating, and electroless copper plating is copper plating with formaldehyde as a reducing agent. The common defects of the two are: first, the application fields and functions are not compatible with each other. Cyanide copper plating can only electroplate copper on metal surfaces, and it is meaningless on non-metals. Electroless copper plating has no application value for copper plating on metal workpieces. The second is that they are all poisonous and harmful substances, which are very...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C23C18/38C23C18/40
Inventor 陈允盈陈洁
Owner 河北聚贤环保科技股份有限公司
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