Capillary type encapsulation method of bare F-P optical fiber transducer

Abstract

The invention discloses a capillary type encapsulation method of a bare F-P optical fiber strain transducer, comprising: determining outer diameter dimension of each cavity according to the outer diameter dimension of a protective sleeve of the F-P optical fiber strain transducer and that of the capillary to manufacture a silica gel die, fixing the F-P optical fiber strain transducer and the capillary in the cavities of the silica gel die, ensuring that the axis of the F-P optical fiber strain transducer and that of the capillary are centered by using the coaxiality of the cavities of the silica gel die, pouring epoxy resin encapsulation material into a pouring gate of the silica gel die, then placing the silica gel die into a vacuum box for vacuum pumping, sucking the diffluent epoxy resin encapsulation material into the capillary provided with the F-P optical fiber transducer, and preparing into a recyclable F-P optical fiber strain transducer after solidification. The F-P optical fiber transducer of the invention is encapsulated and protected at the right center of the capillary, the epoxy resin encapsulation material sucked into the capillary contains no bubbles, and the patenttechnique of the invention has simple process, the silica gel die is recyclable, the operation is simple, the cost is low and the centering performance is good.

Description

Technical field: [0001] The patent of the invention relates to the field of strain detection in composite material manufacturing, and is specially used for the packaging and protection of bare F-P optical fiber sensors for strain detection of fiber-reinforced composite materials. Background technique: [0002] F-P fiber optic sensor is a sensor element with excellent performance and mature technology, which is suitable for strain detection and control in the curing process of composite materials. The F-P fiber optic sensor is small in size, small in signal attenuation, high in sensitivity, simple in structure, and has no special requirements for the light source. It is suitable for strain monitoring during the curing process of resin-based composite materials. However, because the bare F-P optical fiber sensor is thin and fragile, it can only be used once and cannot be reused, and the measurement cost is high. Therefore, packaging and protecting the bare F-P fiber optic sen...

AI Technical Summary

Problems solved by technology

Most of the traditional tube-type packaging and protection methods use direct glue injection. It is difficult to ensure that the axes of the optical fiber sensor and the capillary coincide, and there are air bubbles in the packaging material, which makes it difficult to ensure the stability of the sensing characteristics of the sensor after packaging and protection; The structure of the special device for encapsulating the grating into the capillary is complicated, mainly relying on manual adjustment, it is difficult to ensure the alignment accuracy of the encapsulated F-P fiber optic sensor and the capillary, resulting in high packaging cost

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