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Process for manufacturing polishing pad

一种制造方法、研磨垫的技术，应用在研磨机床、制造工具、研磨工具等方向，能够解决无法采用、浆料泄漏等问题

Inactive Publication Date: 2010-03-03
ROHM & HAAS ELECTRONICS MATERIALS CMP HLDG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, in the case of the production method of Patent Document 9, when the rod or plug of the first resin is disposed in the liquid second resin, voids (pores) are formed at the interface between the two resins, and slurry leakage may occur from the voids.
In addition, the method of Patent Document 9 cannot be adopted when making an extra-long shape (long-shaped) polishing pad.

Method used

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  • Process for manufacturing polishing pad
  • Process for manufacturing polishing pad

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0064] An example of the production method of the cell-dispersed urethane composition will be described below. The preparation method of the bubble-dispersed urethane composition includes the following steps.

[0065] 1) Foaming process for preparing a bubble dispersion liquid of isocyanate-terminated prepolymer

[0066] A polysiloxane-based surfactant is added to the isocyanate-terminated prepolymer (first component), followed by stirring in the presence of a non-reactive gas to disperse non-reactive air cells as fine air cells to obtain an air cell dispersion. When the prepolymer is solid at normal temperature, it is used after being preheated to an appropriate temperature and melted.

[0067] 2) Curing agent (chain extender) mixing process

[0068] A chain extender (second component) was added to the above-mentioned cell dispersion liquid, followed by mixing and stirring to prepare a cell-dispersed urethane composition.

[0069] As the non-reactive gas for forming microb...

Embodiment

[0119] Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

[0120] (Asker D hardness measurement)

[0121] Performed in accordance with JIS K6253-1997. A light transmission region cut into a size of 2 cm×2 cm (thickness: optional) was used as a sample for hardness measurement. In addition, a water-impermeable membrane was prepared from the polyurethane resin paint used in Examples 1, 2 and Comparative Example 1, and cut into a size of 2 cm x 2 cm (thickness: optional) as a sample for hardness measurement. In addition, the PET base material used in Comparative Example 2 was cut into a size of 2 cm×2 cm (thickness: optional), and used as a sample for hardness measurement. These measurement samples were left to stand in an environment with a temperature of 23°C±2°C and a humidity of 50%±5% for 16 hours. During the measurement, the samples were stacked so that the thickness was 6 mm or mor...

manufacture example

[0136] 32 parts by weight of toluene diisocyanate (2,4-form / 2,6-form=80 / 20 mixture), 8 parts by weight of 4,4'-dicyclohexylmethane diisocyanate, 54 parts by weight of polytetramethylene glycol ( Number average molecular weight: 1006) and 6 parts by weight of diethylene glycol were mixed, heated and stirred at 80° C. for 120 minutes to produce an isocyanate-terminated prepolymer (isocyanate equivalent: 2.1 meq / g). 100 parts by weight of the isocyanate-terminated prepolymer and 3 parts by weight of a polysiloxane-based surfactant (manufactured by Toray Dazu Corning Silicone Co., Ltd., SH-192) were mixed to prepare a mixture whose temperature was adjusted to 80°C. 80 parts by weight of this mixture and 20 parts by weight of 4,4'-methylene bis(o-chloroaniline) (manufactured by Ihara Chemical Co., Ltd., Ihara Kyuamin MT) melted at 120° C. were mixed in a mixing chamber while air was dispersed in the mixture by mechanical stirring. In the mixture, a cell-dispersed urethane compositi...

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Abstract

A process for manufacturing a polishing pad excelling in optical detection precision while attaining prevention of slurry leakage from interspaces between polishing area and light transmission area. The process for manufacturing a polishing pad comprises the steps of preparing a urethane composition with dispersed foam according to a mechanical foaming method; while feeding out a face material ormoving a belt conveyor, disposing a light transmission area on the face material or belt conveyor at a given location; continuously discharging the urethane composition with dispersed foam onto the section of the face material or belt conveyor not provided with the light transmission area; superimposing another face material or belt conveyor on the discharged urethane composition with dispersed foam; hardening the urethane composition with dispersed foam so as to form a polishing area of polyurethane foam thereby obtaining a polishing sheet, while conducting a thickness regulation into uniformity,; coating one surface of the polishing sheet with a polyurethane resin coating material containing an aliphatic and / or alicyclic polyisocyanate and hardening the same to thereby provide a water impermeable film; and cutting the polishing sheet.

Description

technical field [0001] The present invention relates to a method for manufacturing a polishing pad capable of stably and efficiently polishing optical materials such as lenses and mirrors, silicon wafers, glass substrates for hard disks, aluminum substrates, and general metals with high requirements. Planarization processing of materials with flat surfaces. The polishing pad of the present invention is particularly suitable for use in the process of planarizing silicon wafers and devices on which oxide layers, metal layers, etc. are formed, before further lamination / formation of these oxide layers or metal layers. Background technique [0002] When manufacturing a semiconductor device, a process of forming a conductive film on the wafer surface and forming a wiring layer by performing photolithography, etching, etc., and a process of forming an interlayer insulating film on the wiring layer are carried out. Due to these processes, metal, etc. Bumps and bumps made of conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00H01L21/304B24B37/20B24B37/22B24B37/24
CPCB24B37/205B24D18/00Y10T428/24322Y10T428/24331Y10T428/24364B24B37/20B24B37/24H01L21/304
Inventor 佐藤彰则广濑纯司中村贤治福田武司堂浦真人
Owner ROHM & HAAS ELECTRONICS MATERIALS CMP HLDG INC