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Resin composition and molded article obtained from the composition

A technology of resin composition and olefin-based polymers, which can be applied in the direction of electrical components, packaging, circuits, etc., can solve the problems of no pollution resistance, no wear resistance, etc., achieve wear resistance suppression, and excellent impact resistance , excellent wear resistance

Active Publication Date: 2010-03-03
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In Patent Document 4, although it is described that the resin composition is excellent in impact strength, especially low-temperature impact properties, there is no description about abrasion resistance, and there is no description about stain resistance.

Method used

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  • Resin composition and molded article obtained from the composition
  • Resin composition and molded article obtained from the composition
  • Resin composition and molded article obtained from the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0296] (A) ethylene and tetracycline [4.4.0.1 2，5 .1 7，10 ]-3-dodecene random copolymer (ethylene·tetracyclododecene random copolymer) 50 parts by weight, MFR is 0.7g / 10min and ethylene content 80mol% (B) ethylene·propylene free After fully mixing 50 parts by weight of a regular copolymer (manufactured by Mitsui Chemicals, Inc., TAFMER P-0680), it was melted at a barrel temperature of 250°C using a twin-screw extruder ("TEX-44" manufactured by Nippon Steel Works, Ltd.) The mixture was kneaded and granulated with a granulator to obtain "granule a".

[0297] The L / D of the twin-screw extruder used here is 42, and a vent hole is provided at the front end of the barrel. The vent holes are all vent holes open to the atmosphere. The screw structure is that the forward flight screw is the center, and kneading discs are arranged before and after the exhaust hole near the center.

[0298]To the "granule a" above, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyne-3 was added as the main ...

Embodiment 2

[0306] Except having used 5 weight part of antistatic agents (E), operation similar to Example 1 was performed and the pellet was obtained and evaluated. The results are shown in Table 1.

Embodiment 3

[0308] Except having used 5 weight part of nonionic stearyl monoglycerides (Electrostriper TS-5 manufactured by Kao Corporation) as an antistatic agent (E), it carried out similarly to Example 1, obtained the granule, and evaluated it. The results are shown in Table 1.

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Abstract

A resin composition of the present invention contains 99 to 30 parts by weight of a cyclic olefin polymer (A); 1 to 70 parts by weight of a soft copolymer (B) obtained by polymerizing at least two kinds of monomers selected from the group consisting of olefins, dienes, and aromatic vinyl hydrocarbons and having a glass transition temperature of 0 DEG C or lower; and relative to 100 parts by weightof total amount of the cyclic olefin polymer (A) and the soft copolymer (B), 0.001 to 1 part by weight of a radical initiator (C), 0 to 1 part by weight of a polyfunctional compound (D) having two ormore radically polymerizable functional groups in a molecule, and 0.5 to 10 parts by weight of a nonionic or anionic antistatic agent (E).

Description

technical field [0001] The present invention relates to a resin composition containing a predetermined antistatic agent, and a molded article obtained therefrom. Background technique [0002] In order to prevent contamination, silicon wafers in the semiconductor manufacturing process, glass substrates in the liquid crystal panel manufacturing process, and metal disks in the hard disk manufacturing process are handled in a clean room. In these manufacturing processes, various resin molded products such as containers, trays, and clamps for efficiently handling these substrates are used. For example, containers for holding multiple substrates at the same time and transporting them from a specific process to the next process in a clean room, containers for performing various processes, and clamps such as tongs for carrying single wafers are used. [0003] For these resin molded products used in a clean room, a high degree of contamination resistance is required so as not to bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L45/00B65D85/86C08L9/06C08L23/00C08L25/02C08L65/00H01L21/673
CPCC08L23/00C08L65/00C08L23/20H01L21/67366C08L9/06C08L23/02C08L2666/06C08L2666/04C08L45/00C08J5/00C08K2201/017
Inventor 金子和义
Owner MITSUI CHEM INC
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