Self-compensating rotary angle device for dicing saw

Abstract

The invention relates to a self-compensating rotary angle device for a dicing saw, aiming fundamentally solving the problems of easy abrasion, large vibration, low accuracy of the rotary angle and processing of the dicing saw and the like of a worm and worm gear transmission device used on the existing wafer saw. The device comprises an assembled type worm wheel assembled on a central shaft and aworm meshed with the assembled type worm wheel. The device has the technical key points that a boss of a lower worm wheel of the assembled type worm wheel is sheathed with an upper worm wheel; the circumferential surfaces of the upper and the lower worm wheels are complete, respectively form an upper and a lower tooth surfaces of the assembled type worm wheel and are respectively and closely contacted with a left and a right tooth surfaces in the same tooth slot of the worm; and a split worm is internally embedded with an extension spring, the two ends of the extension spring are respectivelyconnected with the upper and the lower worm wheels, the end surfaces of the upper and the lower worm wheels cling to and press each other, and screws can be used for limiting the relative circumference displacement of the end surfaces. The self-compensating rotary angle device provides reliable operation guarantee for the cutting quality of the dicing saw, improves the pass rate of the product and reduces the production cost. Therefore, the device is applicable to self compensation of the rotary angle device of the dicing saw and other similar equipment.

Description

technical field [0001] The invention relates to a rotary angle transmission device of a dicing machine, in particular to a self-compensating rotary angle device for a dicing machine with reasonable structural design and reliable working performance. It is suitable for the compensation of the cutting corner device of the dicing machine platform, and can also be used for the self-compensation of the corner device of other similar equipment. Background technique [0002] Grinding wheel dicing machine is a special cutting equipment for processing various semiconductor and other wafer substrates and other similar substrates. It is an important equipment in the semiconductor production process. It is mainly used for semiconductor chips, thermistors, and B ultrasonic transducer heads. , solar cells and other products processing. Grinding wheel dicing machine is a thin slice grinding wheel knife with a minimum thickness of 0.02mm made of fine-grained diamond powder. At a cutting li...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a self-compensating corner device for dicing machines with reasonable structural design and reliable working performance, which fundamentally solves the problems of easy wear, large vibration, and severe The problem of low corner accuracy and machining accuracy of the dicing machine prevents the gap between the worm and the worm gear, keeps the corner of the dicing machine high-precision for a long time, improves the stability of the mechanism, and thus improves the qualified rate of the product. Reduced production costs

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