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Gap thermal insulation device for small space

A heat insulation device and small space technology, which is applied in the direction of heat insulation protection pipelines, heat exchange equipment, lighting and heating equipment, etc., can solve the problem that heat insulation technology cannot be applied to heat isolation, etc., to facilitate standardized production and occupy a small space , the effect of simple structure

Inactive Publication Date: 2011-09-21
陕西科强融合创新研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides a heat insulation device, which effectively solves the problem that the traditional heat insulation technology cannot be applied to heat isolation in some small spaces and small gaps

Method used

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  • Gap thermal insulation device for small space
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Embodiment Construction

[0016] This technology is especially suitable for occasions between high thermal insulation plates with small spaces and small gaps. When the gap between element A and element B is h, it is necessary to ensure high thermal insulation requirements between element A and element B. The traditional heat insulation method is to directly connect A and B with screws, which requires longer screws to achieve, and the gap between A and B is limited by the volume and size of the installation environment, which causes a big contradiction. The present invention makes full use of the space and increases the effective heat dissipation length of the connecting device as much as possible in the X direction, so as to get rid of the limitation of position determination in the Y direction (the distance cannot be greater than h).

[0017] In the heat insulating device provided by the present invention, the element A is installed on the connecting device 2 through the screw 1, and the element B is ...

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Abstract

The invention provides a gap thermal insulation device for a small space, which effectively solves the problems that the conventional thermal insulation technique cannot be applicable to the thermal insulation for micro-gap occasions in a certain small space. The thermal insulation device comprises a component A and a component B, wherein the component A is fixedly connected with the component B through a connecting device, and the connecting device can be a group of connecting rod assembly and can also consists of a plurality of groups of connecting rod assemblies which are connected in series if the space is enough. The connecting rod assembly has a zigzag shape, ring shape or spiral shape. The gap thermal insulation device is characterized by small space occupation, obvious thermal insulation effect, simple and stable structure, a low manufacturing cost, and capability of being used as a standardized component for batch production.

Description

technical field [0001] The invention relates to a thermal insulation device, which is particularly applied to thermal isolation of elements with small space gaps. Background technique [0002] The traditional thermal insulation technology is to increase the thickness or height of the thermal insulation material based on the selection of low thermal conductivity materials. However, in some small spaces and small gaps, it is difficult to achieve high thermal insulation requirements in this way due to space size and volume constraints. For example, when the gap between element A and element B is h, it is required not only to connect A and B stably, but also to ensure good thermal insulation requirements between element A and element B. The traditional heat insulation method is to directly connect A and B with screws, which requires longer screws to achieve, and the gap between A and B is limited by the volume and size of the installation environment, which causes a big contrad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16L59/00
CPCF28F2270/00
Inventor 杨文刚李创樊学武王炜汶德胜
Owner 陕西科强融合创新研究院有限公司