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Insulation layer thermal-shrinkage furnace for capacitor

A heat shrinkable furnace and insulating layer technology, applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of poor heat shrinkage performance, low yield, poor appearance, etc., and achieve the effect of uniform heat shrinkage

Inactive Publication Date: 2010-05-26
NANTONG HICON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the requirements of environmental protection, conventional heat-shrinkable materials cannot be used because their additives contain toxic and harmful substances. The alternative insulation materials that meet environmental protection requirements have poor thermal shrinkage performance, poor appearance, and low yield.

Method used

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  • Insulation layer thermal-shrinkage furnace for capacitor
  • Insulation layer thermal-shrinkage furnace for capacitor

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Experimental program
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Effect test

specific Embodiment approach

[0009] exist figure 1 Among them, the shrinking furnace is sealed by the insulation layer cover 1, the mesh conveyor belt 4 is dragged by the motor 2, the mesh conveyor belt 4 passes through the chains 3 on both sides, and each section of the chains 3 on both sides is connected by the long axis 5, and the upper half of the chain 3 The lower part has a support block 7 to ensure that the upper half of the chain 3 is always on a plane. The capacitor covered with the insulating protective layer is placed on the long axis and can be moved and rotated. Temperature 120℃-240℃, flow rate 20-60m 3 The hot gas per hour is surrounded by the hot gas that flows reasonably and shrinks evenly to achieve a good shrinkage effect. It is especially used in capacitors with a diameter of 35mm and a height of 60mm or more. It can shrink materials with environmental protection requirements well, significantly improve the appearance and reduce Rework rate, reduce manufacturing cost.

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Abstract

The invention relates to an insulation layer thermal-shrinkage furnace for a capacitor, which comprises a furnace body, a heater, a temperature control system and a furnace door opening. The aluminum electrolytic capacitor coated with the insulation protection layer is conveyed by a net-shaped conveying belt, a motor drives a chain to drive the net-shaped conveying belt to move, both sides of the net-shaped conveying belt are provided with chains, corresponding sections of the two chains are connected by a long axis, and the lower part of the chain on the upper half part is provided with a support block, so that the chain on the upper half part is ensured to be always in one plane. The capacitor coated with the insulation protection layer is arranged on the long axis, and the support block goes from the exit to the entrance through a hearth with the heater. The aluminum electrolytic capacitor coated with the insulation protection layer can move and rotate in the hearth by the movement of the net-shaped conveying belt, so that the thermal shrinkage uniformity is ensured.

Description

1. Technical field [0001] The invention relates to a heat shrinking furnace for the insulating layer of a capacitor. 2. Background technology [0002] At present, most of the surfaces of aluminum electrolytic capacitors are covered with one or more layers of insulating protective layers to prevent the aluminum shell of the capacitor from contacting with the circuit board or other electronic components to form a short circuit. With the requirements of environmental protection, conventional heat-shrinkable materials cannot be used due to the toxic and harmful substances contained in their additives. The alternative insulation materials that meet the requirements of environmental protection have poor thermal shrinkage performance, poor appearance, and low yield. 3. Contents of the invention [0003] The invention provides a thermal shrinkage furnace for capacitor insulating and protective layers with a mesh conveyor belt. [0004] The technical solution adopted by the presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00
Inventor 顾义明赵建保刘鼎朱金祥
Owner NANTONG HICON ELECTRONICS
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