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Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam

A solid epoxy resin, epoxy resin technology, used in the field of skeleton construction adhesives, structural reinforcements and structural foams, can solve problems such as deterioration

Active Publication Date: 2010-06-09
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical properties of such compositions, especially glass transition temperature, and adhesive properties, are significantly worsened due to the high proportion of SBS block copolymer

Method used

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  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam

Examples

Experimental program
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Effect test

Embodiment

[0189] Some examples will be described below, which further illustrate the invention, but are in no way intended to limit the scope of the invention in any way. The raw materials used in the examples are listed in Table 1.

[0190]

[0191]

[0192] Table 1. Raw materials used

[0193] Compositions were prepared from the ingredients indicated in Tables 2 and 3 in parts by weight. Comparative Example Ref. 1 is Example 4A of US 6387470 .

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Abstract

Hot-curing epoxy resin compositions are disclosed which firstly are solid in a hardened state at room temperature and secondly form an adhesion-free surface and are impact-resistant and can have high glass transition temperatures, above, for example, 110 DEG C. An exemplary hot-curing epoxy resin composition can form separate phases on hardening, a continuous phase being formed by epoxy resins. If the compositions include a blowing agent, they can have excellent suitability for production of foams, such as structural foams.

Description

technical field [0001] The present invention relates to the field of thermosetting epoxy resin compositions, in particular the use of said thermosetting epoxy resin compositions as Rohbau adhesives, structural reinforcements and structural foams. Background technique [0002] Heat-curing epoxy resin adhesives have been used for a long time as adhesives in skeleton construction and in reinforcing elements or structural foams. [0003] Known heat-curing epoxy adhesives, especially impact-resistant epoxy adhesives, are typically liquid or at least pasty at room temperature. This is disadvantageous when the composition is applied and is intended to be stored dimensionally stable until curing. In addition to the effect due to the shape change in the uncured state during storage, there is the disadvantage that such shaped bodies are also very dust-generating, which in turn entails disadvantages in terms of handling and bonding of such shaped bodies. It is therefore highly desira...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L33/02C08L25/06C08G59/50C08L53/02C08L33/20C09J163/00C09J5/06C09J5/08C08J9/04
CPCC08G59/226C08G59/4014C08L63/00C09J163/00C08L2666/22C08J2363/00C08J9/0061C08J2433/06C08J2425/08C08J2409/02C08J2453/00C08J2475/04C08L25/04C08J9/22B32B27/38B32B37/06B32B37/1207B32B37/1284B32B2307/306B32B2309/02B32B2311/00B32B2605/00B32B2607/00C09J2463/00
Inventor J·芬特E·詹多比
Owner SIKA TECH AG
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