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Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam

A solid epoxy resin, epoxy resin technology, applied in the field of structural reinforcement, structural foam, and skeleton construction adhesives, can solve problems such as variation

Inactive Publication Date: 2013-07-24
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical properties of such compositions, especially glass transition temperature, and adhesive properties, are significantly worsened due to the high proportion of SBS block copolymer

Method used

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  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam
  • Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam

Examples

Experimental program
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Effect test

Embodiment

[0189] Some examples will be described below, which further illustrate the invention, but are in no way intended to limit the scope of the invention in any way. The raw materials used in the examples are listed in Table 1.

[0190]

[0191]

[0192] Table 1. Raw materials used

[0193] Compositions were prepared from the ingredients indicated in Tables 2 and 3 in parts by weight. Comparative Example Ref. 1 is Example 4A of US 6387470 .

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PUM

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Abstract

Heat-hardenable epoxide resin composition (I) comprises at least an epoxide-liquid resin (A1) with an average of one epoxide group per molecule; at least an epoxide-solid resin (A2) with an average of one epoxide group per molecule; at least a polymer impact modifier (D); at least a homopolymer (HP) of an olefinically unsaturated monomer (M), which is solid at room temperature; and at least a hardener (B) for epoxide resin, which is activated at high temperature; where the weight portion of D is less than 20 wt.%, and the weight quantity of (HP) is larger than the weight quantity of (D). Independent claims are included for: (1) a reinforcing element for reinforcing metal structures comprising a carrier on which (I) is applied; (2) adhering heat stable substrates comprising applying (I) on the surface of a heat stable substrate (S1), preferably a metal, contacting the applied surface with another surface of a heat stable substrate (S2), preferably a metal, and heating (I) at 100-200[deg] C, preferably 160-190[deg] C; (3) a structural foam obtained by heating (I); and (4) hardened epoxide resin composition obtained by heating (I) at 100-200, preferably 120-200[deg] C.

Description

technical field [0001] The present invention relates to the field of thermosetting epoxy resin compositions, in particular the use of said thermosetting epoxy resin compositions as Rohbau adhesives, structural reinforcements and structural foams. Background technique [0002] Heat-curing epoxy resin adhesives have been used for a long time as adhesives in skeleton construction and in reinforcing elements or structural foams. [0003] Known heat-curing epoxy adhesives, especially impact-resistant epoxy adhesives, are typically liquid or at least pasty at room temperature. This is disadvantageous when the composition is applied and is intended to be stored dimensionally stable until curing. In addition to the effect due to the shape change in the uncured state during storage, there is the disadvantage that such shaped bodies are also very dust-generating, which in turn entails disadvantages in terms of handling and bonding of such shaped bodies. It is therefore highly desira...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L33/02C08L25/06C08G59/50C08L53/02C08L33/20C09J163/00C09J5/06C09J5/08C08J9/04
CPCC08L63/00C09J163/00C08G59/226C08G59/4014C08L2666/22C08J2363/00C08J9/0061C08J2433/06C08J2425/08C08J2409/02C08J2453/00C08J2475/04C08L25/04C08J9/22B32B27/38B32B37/06B32B37/1207B32B37/1284B32B2307/306B32B2309/02B32B2311/00B32B2605/00B32B2607/00C09J2463/00
Inventor J·芬特E·詹多比
Owner SIKA TECH AG
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