Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor device and method of modifying an integrated circuit

A technology of integrated circuits and semiconductors, applied in semiconductor devices, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as prolonging the manufacturing time of semiconductor chips, shortening the life of semiconductor chips, and affecting the normal operation of semiconductor chips

Inactive Publication Date: 2010-06-16
MEDIATEK INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first method will prolong the manufacturing time of semiconductor chips and greatly increase the cost of semiconductor chips
The second approach may shorten the life of the semiconductor chip, and more seriously may affect the normal operation of the semiconductor chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device and method of modifying an integrated circuit
  • Semiconductor device and method of modifying an integrated circuit
  • Semiconductor device and method of modifying an integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] Certain terms are used in the claims and description to refer to particular elements. Those of ordinary skill in the art should understand that hardware manufacturers may use different terms to refer to the same element. The claims and description of the present invention do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. The "comprising" mentioned throughout the specification and subsequent claims is an open term, so it should be interpreted as "including but not limited to". Otherwise, the term "coupled" includes any direct and indirect means of electrical connection. Therefore, if it is described that a first device is coupled to a second device, it means that the first device may be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means.

[0014] Please also refer t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a semiconductor device and method of modifying an integrated circuit. The semiconductor device includes an integrated circuit and a connecting component. The present invention is characterized in that the integrated circuit includes a first pad; a second pad; a first current guiding circuit, coupled to the first pad and a first reference voltage, for selectively guiding a first specific electrical signal received from the first pad to the first reference voltage; and a second current guiding circuit, coupled to the second pad and a second reference voltage, for selectively guiding a second specific electrical signal received from the second pad to the second reference voltage; and the connecting component is external to the integrated circuit for coupling the first pad and the second pad. Thereby, adverse effects on a ESD protection circuit having defects can be avoided without redesigning the ESD protection circuit of a semiconductor chip.

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly to a semiconductor device and a method of modifying an integrated circuit comprising an integrated circuit having pads coupled by external connection elements. Background technique [0002] usually, such as figure 1 As shown, the main surface of the semiconductor die includes a plurality of bonding pads, and the bonding pads are located around the edge of the main surface of the semiconductor die. figure 1 It is a schematic diagram of the main surface of an existing semiconductor die. A plurality of bonding wires 110 are respectively bonded to a plurality of bonding pads 120 to electrically couple external signals (such as power supply, ground source, input signal, output signal, etc.) to the semiconductor die. For each bonding pad 120 (that is, a power / ground pad) coupled to a power / ground source, there is always an electrostatic discharge (Electrostatic Discharging, ESD)...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/60H01L21/60
CPCH01L2924/14H01L2224/05553H01L23/60H01L2924/01082H01L2224/05599H01L24/06H01L2224/45099H01L2224/4813H01L2224/49175H01L2924/01023H01L24/49H01L2924/01033H01L2224/85399H01L2924/00014H01L2924/30107H01L24/48H01L2224/05554H01L2924/00
Inventor 冉景涵林育信
Owner MEDIATEK INC