Evaporation-cooled device attached to surface of super computer

Abstract

The invention relates to an evaporation-cooled device attached to the surface of a super computer. A condenser (15) is arranged at the top of a super computer cabinet; and a liquid collection header pipe (11) is positioned downmost the evaporation-cooled device. N cooling liquid boxes (9) are positioned between the liquid collection header pipe (11) and a steam collection header pipe (12). A steam outlet pipe (13) is positioned above the steam collection header pipe (12) and under the condenser (15). The steam collection header pipe (12) is connected with the condenser (15) through the steam outlet pipe (13), and the condenser (15) is connected with the liquid collection header pipe (11) through a liquid returning pipe (14). The cooling liquid boxes (9) are in tight contact with heating elements of the super computer, N liquid inlet pipes (7) contained on the N cooling liquid boxes (9) are respectively communicated with the liquid collection header pipe (11), and N steam outlet pipes (8) contained on the N cooling liquid boxes (9) are respectively communicated with the steam collection header pipe (12), thereby forming an enclosed circulation cooling loop. A plurality of liquid channels with inner cavity bodies mutually communicated are arranged in the cooling liquid boxes (9) connected in parallel on a liquid path.

Description

technical field [0001] The invention relates to a supercomputer system cooling system. Background technique [0002] In recent years, the research and development of supercomputers has developed rapidly, and has been widely used in various fields. However, while the integration, data processing capability and calculation speed of supercomputers are constantly improving, their energy consumption is also increasing, and the heat generation of chips and complete machines is becoming more and more serious. The cooling of supercomputers has become an imminent bottleneck that needs to be solved urgently. [0003] The current supercomputer mainly adopts the traditional air cooling method. Although the system is safe and reliable, easy to operate and easy to maintain, the cooling efficiency is low. Moreover, with the improvement of integration, there are many components arranged in the unit space, and the heat dissipation equipment makes it difficult to distribute the airflow evenl...

AI Technical Summary

Problems solved by technology

This is not applicable to some devices that have clear industry specifications and cannot change the structural position, especially in the field of supercomputers that require distributed heat sources, relatively fixed structural positions, and require high integration of computing units.

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