Assembling method and assembling tool for memory and radiating plate

Abstract

The invention discloses an assembling method and an assembling tool for a memory and a radiating plate, the method comprises: a) the memory and the radiating plate are provided; b) the surface of the radiating plate is coated by viscose; c) the memory is vertically placed on the radiating plate; d) the radiating plate is led to bend to the memory for attaching to the memory, in order to realize combination through the viscose. The assembling tool comprises a platform, two positioning arms, and two clamp plates, wherein, the two positioning arms mutually opposites at interval and are vertically arranged at the platform, and the inner side walls which correspond to the two positioning arms are all provided with grooves which extend from up to down; additionally, the two clamp plates are relatively arranged in a flat way and are pivotally arranged between the two positioning arms respectively, and can overturn towards the opposite direction for each other; therefore, the radiating plate which is coated by the viscose is placed on the two clamp plates in a flat way, the memory is inserted between the two grooves, through the overturning of the two clamp plates, the radiating plate is led to bend to the memory to be attached to the memory, in order to simplify the process, speed-up production and increase the production efficiency.

Description

technical field [0001] The invention relates to an assembly technology, in particular to an assembly method of a memory and its heat sink, and a tool used in the method. Background technique [0002] Due to the advancement of computer technology products, in addition to the cooling requirements of the central processing unit (CPU) on the motherboard of the computer, even the VGA card inserted on the motherboard and the Random Access Memory (Random Access Memory, RAM), Also all have overheating phenomenon and must further carry out heat dissipation for the chipset on it, as the case of the novel patent of No. M300870 " memory cooling clip and assembly tool " of Taiwan's new announcement. [0003] Such as figure 1 As shown, it is a three-dimensional schematic view of the use state of the memory cooling clip disclosed in the above-mentioned patent. Wherein, the heat dissipation clip 1a can be assembled on a memory 2a, and cover the chips of the memory 2a; the heat dissipation...

AI Technical Summary

Problems solved by technology

[0005] 1. The heat sink clip 1a must be bent and formed before it can be assembled with the memory 2a, so its manufacturing process is relatively complicated and cannot be combined in the same production step to simplify the process

[0006] 2. The tools and assembly parts (such as heat sink 1a, memory 2a) are operated horizontally, so it takes up more space in the design of the machine

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