Thermal interface material and using method thereof

Abstract

The invention relates to a thermal interface material used for transferring heat on a heat source to a radiating device. The heat source has a protective temperature for preventing the heat source from being damage due to overheating, and the thermal interface material is located between the heat source and the radiating device. The thermal interface material includes a flexible matrix and at least one first heat conduction granule filled in the flexible matrix, wherein the grain diameter of the first heat conduction granule before melting is smaller than 100nm and the melting point is lower than the protective temperature; the grain diameter of the first heat conduction granule after melting is larger than 100nm and the melting point is higher than the protective temperature. The invention also relates to a using method of the thermal interface material.

Description

technical field [0001] The invention relates to a thermal interface material and a method for using the thermal interface material. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, and the volume of devices has become smaller and smaller. However, the reduction in the volume of semiconductor devices has also increased its requirements for heat dissipation. In order to meet the heat dissipation requirements of the semiconductor devices, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and certain heat dissipation effects have been achieved. However, because the contact interface between the heat sink and the heat source (semiconductor integrated device, such as CPU) is uneven, the actual contact area is generally less ...

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Problems solved by technology

However, the first heat-conducting particles with a low melting point are in a molten state during operation, and their own thermal conductivity will drop significantly, thereby affecting the thermal conductivity of the thermal interface material; in addition, most heat-conducting particles with high thermal conductivity will not work at the operating temperature of the heat source. It is difficult to melt, such as the melting point of silver, aluminum, copper, etc. with excellent thermal conductivity are above 350 ° C, while the operating temperature of most heat sources is below 350 ° C, such as the operating temperature of the CPU below 120 ° C, which makes the first heat conduction Particle selection is very limited

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