COB soft foundation module, RFID electronic tag using same and manufacturing method thereof

Abstract

The invention discloses a COB soft foundation module, an RFID electronic tag and a manufacturing method thereof. The RFID electronic tag consists of a massive soft foundation and a COB soft foundation module which are manufactured independently, wherein the massive soft foundation consists of an RFID tag antenna and a soft insulated base material bearing the RFID tag antenna; the COB soft foundation module comprises a bridging metal film line, a soft insulated base material, an RFID chip and a bonding projection; the RFID chip and the bridging metal film line are fixedly connected through an anisotropic conducting adhesive; and the RFID tag antenna and the bridging metal film line are in electrical connection by bridging adhesion. By adopting a split binary structure modularized pre-packaging mode, the disadvantage that the multi-item production of the RFID electronic tag in a conventional inverse packaging process has poor consistency is well overcome, and the COB soft foundation module has the advantages of strong flexibility and reliability, more favorable realization of serialized and diversified production on a large scale, low production cost, high consistency, micromation and the like.

Description

technical field [0001] The invention relates to an RFID electronic tag and a manufacturing method thereof, in particular to an RFID electronic tag, a COB soft base module for the RFID electronic tag, a manufacturing method of the COB soft base module, and a manufacturing method of the RFID electronic tag. Background technique [0002] The electronic tag using radio frequency identification (RFID) is mainly composed of an induction antenna and an integrated circuit chip. In the electrical interconnection between the antenna and the chip, the widely used method is Flip Chip (Flip Chip) technology, which directly flips the bare chip on the end of the flexible antenna. It has high production efficiency, low cost, high performance, high Reliable and miniaturized packaging and other advantages. However, due to the variety of antenna structures and the different specifications and applications of RFID chips, and the current integrated circuit flip-packaging equipment has poor flex...

AI Technical Summary

Problems solved by technology

However, due to the variety of antenna structures and the different specifications and applications of RFID chips, and the current integrated circuit flip-packaging equipment has poor flexibility, in the actual flip-packaging technology, the interconnection of electronic tag antennas of various specifications and sizes is realized. , The impedance matching between the antenna end and the chip is difficult. To realize the production of flexible substrates in large quantities, with high efficiency and

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