Upright fully encapsulating sealing structure with inverse T-shaped heat dissipation block of chip of printing circuit board

Abstract

The invention relates to a fully encapsulating sealing structure with an inverse T-shaped heat dissipation block of a chip of a printing circuit board, which comprises a chip (3), a single layer or a plurality of layers of printing circuit boards (9) borne under the chip, metal wires (10) for the interconnection of signals from the chip to the single layer of the plurality of layers of printing circuit boards, conductive or non-conductive heat conduction adhesive materials I (2) between the chip and the single layer or the plurality of layers of printing circuit boards, and a plastic sealing body (8). The invention is characterized in that the heat dissipation block (7) is arranged above the chip (3), and conductive or non-conductive adhesive materials II (6) are embedded between the heat dissipation block (7) and the chip (3). The heat dissipation block (7) is fully encapsulated in the plastic sealing body (8), and the heat dissipation block (7) is in an inverse T-shaped structure. In the invention, the heat dissipation block is additionally arranged above the chip so as to play the role of high heat dissipation, the heat dissipation capacity is strong, and the heat of the chip can be quickly transmitted to the outside of the sealing body.

Description

(1) Technical field [0001] The invention relates to a printed circuit board chip front-mounted inverted T-shaped cooling block full-cover packaging structure. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, and at the sam...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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